Explosive phenomenon of AlCu/TiN and W-plugs multilevel interconnect system (original) (raw)

1998

Abstract

The 'explosive phenomenon' of AlCu/TiN metal line (explosive defect) always be observed posterior to deposit oxide film by Plasma Enhanced Chemical Vapor Deposition (PECVD) and their profile look like distorted bamboo structure. From the Tunneling Electronic Microscope (TEM) analysis result and the defect distribution on the wafer, the defects were enhanced by the compressive stress of oxide film. The tungsten

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