Characterisation of metal coated polymer balls for BGA and CSP applications (original) (raw)

2009

Abstract

ABSTRACT A metal-coated ball based on a polymer core is under development for chip scale packaging (CSP) and ball grid array (BGA) applications. Different polymer cores have been produced and evaluated in order to optimise the mechanical properties of the ball. From a range of candidates with highly diverse properties, a candidate material has been proposed. This decision is based on a combination of a very low thermal expansion coefficient of 25 ppM/0C and E-modulus, which is of the order of 600 MPa.

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