Soldering, Adhesive Bonding, and Bonding (original) (raw)

Photonic Packaging Sourcebook, 2015

Abstract

This chapter discusses and analyzes the bonding of OEIC and its electrical and thermal environment. First, the bonding interface between the OEIC and the heat sink would be investigated. In the following, failure mechanisms and reliability tests are discussed. Adhesive bonding takes more and more place in the electrical packaging especially for flexfoil and thermal sensitive chips. An overview of different gluing mechanisms is given. Finally, the different types of wire bonding techniques are depicted and compared in conjunction with practical examples for the application with RF connections.

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