Technical Design Report for the: PANDA Micro Vertex Detector (original) (raw)

Abstract

sparkles

AI

This technical design report details the PANDA Micro Vertex Detector, a critical component of the PANDA experiment aimed at investigating strong interactions through antiproton annihilation. A comprehensive overview of the PANDA experiment and its tracking concept is provided, emphasizing the advanced technologies and methodologies employed in detector design and data acquisition within the context of the new Facility for Antiproton and Ion Research (FAIR). The report outlines the project's significance in nuclear and hadron physics and discusses the engineering challenges and solutions inherent in the development of the micro vertex detector.

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  160. 20 Cell output for an input charge of 0.5 fC . . . . . . . . . . . . . . . . . 48
  161. 21 ToPix v2 simplified schematic . . . . 48
  162. 22 ToPix v2 die . . . . . . . . . . . . . 49
  163. 23 Dice cell schematic . . . . . . . . . . 49
  164. 24 Diagram of the data acquisition sys- tem for testing ToPix v2 . . . . . . . 49
  165. 25 Input-output transfer function . . . 50
  166. 26 Deviation from linear fit . . . . . . . 50
  167. 33 Weibull fit to the experimental ion data of the ToPix v2 configuration register . . . . . . . . . . . . . . . . 52
  168. Analog Cell Layout . . . . . . . . . . 54
  169. 38 CSA with a feedback circuitry which automatically compensates for the detector leakage current . . . . . . . 55
  170. 39 Schematic of the constant feedback current generator . . . . . . . . . . . 55
  171. 40 Comparator schematic . . . . . . . . 56
  172. 42 Calibration circuit schematic . . . . 56
  173. 43 Reconstructed signal shapes with threshold scan for different input charge values . . . . . . . . . . . . . 57
  174. 44 ToPix v3 extrapolated baseline be- fore and after equalisation . . . . . . 57
  175. 45 ToPix v3 baseline distribution before and after correction . . . . . . . . . 57
  176. 46 ToPix v3 pixel map for the four tested samples . . . . . . . . . . . . 58
  177. 48 ToPix v3 measured noise . . . . . . . 58
  178. 49 ToPix v3 transfer function for nomi- nal feedback current -full range . . . 58 3.50 ToPix v3 transfer function for nomi- nal feedback current -0.6 fC range . 59
  179. 51 ToPix v3 transfer function for halved feedback current -full range . . . . . 59
  180. 52 ToPix v3 transfer function for halved feedback current -0.6 fC range . . . 59
  181. 53 Dead pixel counts in the tested as- semblies . . . . . . . . . . . . . . . . 60
  182. 54 Source profile obtained from S8 (Epi- 75) assembly using a 90 Sr source . . 60
  183. 55 Pixel matrix layout . . . . . . . . . . 60
  184. 56 Scheme of the assembly . . . . . . . 61
  185. 57 Photograph of epitaxial sensor pro- duced at FBK . . . . . . . . . . . . . 61
  186. 58 S2 module: two readout chips are bump bonded to a single sensor . . . 61
  187. 61 The complete forward pixel assembly scheme . . . . . . . . . . . . . . . . . 62
  188. 62 Busses for different pixel modules . . 62
  189. 64 SU8 strips . . . . . . . . . . . . . . . 63
  190. 65 Slope of an SU8 strip . . . . . . . . . 63
  191. 66 Staircase multilayer . . . . . . . . . . 63
  192. 67 Bus with module controllers . . . . . 64
  193. 1 Floorplan of wafer with full size pro- totype sensors . . . . . . . . . . . . . 67
  194. 2 Wafer including Prototype Sensors . 68
  195. 3 Layout detail of MVD-Barrel DSSD Sensors . . . . . . . . . . . . . . . . 68
  196. I-V-Curves of Si-Strip prototype Sensors . . . . . . . . . . . . . . . . 69
  197. 6 Effective bulk doping concentration vs. 1 MeV equiv. neutron fluence . . 69
  198. 7 Annealing behaviour of leakage cur- rent characteristics . . . . . . . . . . 70
  199. 8 Annealing behaviour of capacitance characteristics . . . . . . . . . . . . . 70
  200. 11 Schematic of modified ToPix ASIC for strip readout . . . . . . . . . . . 73
  201. 12 Schematic of the Module Data Con- centrator . . . . . . . . . . . . . . . 74
  202. 13 Basic concept for the hybridisation of double-sided strip detectors . . . . 75
  203. 14 Illustration of the hybridisation con- cept for the strip barrel part . . . . . 76
  204. 15 Schematic cross section of a strip hy- brid structure in the barrel part . . . 77
  205. 16 Illustration of the hybridisation con- cept for the strip disks . . . . . . . . 77
  206. 17 Layout of pitch adaptor hybrid . . . 77
  207. 18 Photograph of a finally assembled detector module for the laboratory test setup . . . . . . . . . . . . . . . 78
  208. 19 Photograph of the fabricated pitch adapter and schematics of the pad geometry . . . . . . . . . . . . . . . 78
  209. 20 Results obtained with a laboratory setup for double-sided strip detectors 79
  210. 1 GBT and VL scheme . . . . . . . . . 82
  211. 2 GBT data packet format . . . . . . . 82
  212. 3 Architecture of the lower levels of the PANDA DAQ system . . . . . . . . . 83
  213. 5 Low mass cables implementing alu- minium microstrips. . . . . . . . . . 86
  214. 6 Linear resistance measured for the first 20 tracks of each sample. . . . . 86
  215. 7 Total jitter evaluated for just the mi- crostrips without any transceivers. . 87
  216. 8 Example of an eye diagram. . . . . . 87 5.
  217. 9 Longitudinal cross-section of the MVD and the cross-pipe sector . . . 88
  218. 10 Maximum vertical displacement of the frame under static load . . . . . 88
  219. 11 Cams system. Cylindrical cam on upper end for fixing the half frame . 89
  220. 12 Cams system. The V insert . . . . . 89
  221. 13 Cams system. The U insert . . . . . 89 5.14 Structure of a pixel barrel super module . . . . . . . . . . . . . . . . . 90
  222. 15 Transverse section of a pixel barrel super module . . . . . . . . . . . . . 90 5.16 Support structure of the pixel barrel 90 5.17 Half barrel assembled on the cone support . . . . . . . . . . . . . . . . 91
  223. 18 The cut of the shape of the disk from the plate with wire EDM . . . . . . 91
  224. 19 Machining of the disks elements . . . 91 5.20 Sketch of the set of half disks com- posing half of the pixel forward de- tector . . . . . . . . . . . . . . . . . 92
  225. 21 Sketch of the support structure for the strip disks . . . . . . . . . . . . . 92
  226. 22 Sketch of the common support barrel for BL3 and BL4 . . . . . . . . . . . 93
  227. 23 Sketch of the set of two strip super modules with a common cooling pipe 93
  228. 24 The Pixel volume, with 2 barrels and 6 disks . . . . . . . . . . . . . . . . . 95
  229. 25 Test results: Young's modulus [MPa] vs radiation levels for POCO FOAM 95
  230. 26 Test results: Young's modulus [Mpa] vs radiation levels for POCO HTC . 95
  231. 27 Test results: thermal conductivity [W/(m • K)] vs radiation levels for POCO FOAM . . . . . . . . . . . . 95
  232. 28 Test results: thermal conductivity [W/(m•K)] vs radiation levels for POCO HTC . . . . . . . . . . . . . . 95
  233. 29 Half small disk in carbon foam com- pleted of chips, detectors, cooling tube and fitting . . . . . . . . . . . . 96
  234. 30 Half big disk in carbon foam com- pleted of chips, detectors, cooling tube and plastic fittings . . . . . . . 96
  235. 31 FEM analysis results with real con- figuration . . . . . . . . . . . . . . . 97
  236. 32 FEM analysis results with test con- figuration . . . . . . . . . . . . . . . 97
  237. 33 Carbon foam disk with 6 inserted cooling pipes and 54 resistors (dummy chips) . . . . . . . . . . . . 97
  238. 34 Test results: Thermal map of disk prototype, dissipating 94 W . . . . . 97
  239. 35 Pressure drop [bar] in a S-shape tube vs mass flow rate [l/min] . . . . . . . 97
  240. 36 Pressure drop [bar] in a U-shape tube vs mass flow rate [l/min] . . . . . . . 98