Fabrication and Characterization of Smooth Si Mold for Hot Embossing Process (original) (raw)

IEEJ Transactions on Sensors and Micromachines, 2007

Abstract

In this paper, we propose a fabrication and characterization of silicon mold for PMMA hot embossing process. Silicon molds were fabricated from silicon wafer with thickness of 500mum. First, DRIE technique was performed after optimized etching time and deposition (passivation) time to obtain a depth of 30mum with positive tapered sidewall of 1°. This is very important for de-molding process

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