Mechanical Modeling and Sensitivity Evaluation of an Electrodynamic MEMS Microsensor (original) (raw)

In this paper, we present the mechanical modeling of a MEMS electrodynamic microphone using finite element analysis. This new model aims to study the mechanical design of a microphone to predict its dynamic range performance. Two coaxial planar inductors, one external and the other is internal, are used in this microphone design. When the external inductor is flown by a current, it will produce a magnetic field within the internal suspended one located on the top of a suspended membrane above a micromachined cavity. In the present study, the membrane is attached around its edges, to avoid opening in the top membrane surface which leads usually to an acoustic short path in low frequencies that can affect the microphone performance. So, both membrane resonant frequency and displacement have been determined according to the used technology in IIT Bombay-India. The frequency was optimized around 1.6 KHz in the geometric mean of the acoustic band (2 0 Hz -20 k Hz ) and the harmo nic displa cemen t w as around 8µm for the main resonant frequency. Finally, the sensitivity was evaluated by coupling different transducer domains involved in the microsensor principle and by using the lumped element model of the microphone. The ultimate sensitivity was found around 0.1V/Pa, which is considered to be quite good compared to previously published sensitivities. However, the bandwidth was quite narrow for acting as a microphone.