Design & Development of a Large Die and Fine Pitch Wafer-Level Package for Mobile Applications (original) (raw)

Wafer level packaging offers the advantage of chip scale packaging with an efficient production approach. In addition to size, cost and ease of logistics make it as a main stream packaging solution for a single chip. Resulting saving in size, cost has also resulted in limitation of using conventional wafer level packaging for large die size and high IO devices. This paper reports the development of a wafer level package with 440 IOs, 400 microns pitch and 12 X 12 mm die size for mobile applications.