Tunable Transmitter for Serial 100 Gb/s Connectivity Inside Flexible Data Centers Using Hybrid Polymer Integration (original) (raw)

We introduce a platform based on passive and electro-optic polymers, and present a serial 100G transmitter with 22-nm tunability. We achieve 100-Gb/s transmission over 1625-m, and demonstrate the flexibility of the transmitter inside data-center networks. 1. Introduction Next generation 100 Gigabit Ethernet (GbE) interfaces have the potential to overcome the limitations in terms of throughput and line card density that 10 and 40 GbE interfaces face today in intra-data center networks (iDCNs). For this reason they are expected to be widely deployed in the future, interconnecting switches at the higher layers of the electrical packet switching hierarchy or switches at the edge of the optical circuit switched (OCS) domain of these networks over distances up to 2-km [1]. Along this line, we recently demonstrated transmitters for single-and multi-100 GbE interfaces, which rely on the hybrid integration of an electro-optic (EO) polymer photonic circuit (polyboard) with a laser diode and u...

Cost-effective 10 Gb/s polymer-based chip-to-chip optical interconnect

Board-level optical links are an attractive alternative to their electrical counterparts as they provide higher bandwidth and lower power consumption at high data rates. However, on-board optical technology has to be cost-effective to be commercially deployed. This study presents a chip-to-chip optical interconnect formed on an optoelectronic printed circuit board that uses a simple optical coupling scheme, cost-effective materials and is compatible with well-established manufacturing processes common to the electronics industry. Details of the link architecture, modelling studies of the link's frequency response, characterisation of optical coupling efficiencies and dynamic performance studies of this proof-of-concept chip-to-chip optical interconnect are reported. The fully assembled link exhibits a 23 dBe bandwidth of 9 GHz and 23 dBo tolerances to transverse component misalignments of +25 and +37 mm at the input and output waveguide interfaces, respectively. The link has a total insertion loss of 6 dBo and achieves error-free transmission at a 10 Gb/s data rate with a power margin of 11.6 dBo for a bit-error-rate of 10 212. The proposed architecture demonstrates an integration approach for high-speed board-level chip-to-chip optical links that emphasises component simplicity and manufacturability crucial to the migration of such technology into real-world commercial systems.

A terabit capacity passive polymer optical backplane based on a novel meshed waveguide architecture

An optical backplane based on a meshed polymer waveguide architecture enabling high-speed board-to-board optical interconnection is presented. This planar array of multimode polymer waveguides can provide passive strictly non-blocking links between server line cards fitted with optical transmitter and receiver arrays. This architecture offers a scalable and low-cost solution to the bandwidth limitations faced by electrical backplanes and is suitable for PCB integration. The reported backplane demonstrator uses a matrix of 100 waveguides each capable of 10 Gb/s operation to interconnect 10 cards for a total capacity of a terabit per second aggregate data rate in multicast mode. Character-isation of the backplane demonstrator reveals low link losses of 2 to 8 dB for a multimode fibre input and crosstalk values below −35 dB. Error free data transmission at 10 Gb/s is achieved with a power penalty of only 0.2 dB at a bit-error-rate of 10 −9. Additionally, lossless operation of a Gigabit Ethernet link over the backplane is achieved even when using the worst-case highest loss links.

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