Sol–gel bonding of silicon wafers (original) (raw)

Thin Solid Films, 2005

Abstract

Low temperature bonding of silicon wafers was achieved using sol–gel technology. The initial sol–gel chemistry of the coating solution was found to influence the mechanical properties of the resulting bonds. More precisely, the influence of parameters such as the alkoxide concentration, water-to-alkoxide molar ratio, pH, and solution aging on the final bond morphologies and interfacial fracture energy was studied. The

Christophe Barbé hasn't uploaded this paper.

Let Christophe know you want this paper to be uploaded.

Ask for this paper to be uploaded.