TEM microstructural analysis of As-Bonded Al–Au wire-bonds (original) (raw)
Related papers
Microstructural evolution of gold–aluminum wire-bonds
Ziv Atzmon, Adi Karpel, Wayne Kaplan
Journal of Materials Science, 2007
New mechanisms of void growth in Au–Al wire bonds: Volumetric shrinkage and intermetallic oxidation
Scripta Materialia, 2011
Intermetallic phase transformations in Au–Al wire bonds
Intermetallics, 2011
Modeling and Measuring Uniformity of Intermetalic Formation from the Au-Al Wire Bonding Image
2005
Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds
Acta Materialia, 2011
Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability
Journal of Electronic Materials, 2006
Influence of Intermetallic Phases on Reliability in Thermosonic Au-Al Wire Bonding
2006 1st Electronic Systemintegration Technology Conference, 2006
Effect of Conduction Pre-heating in Au-Al Thermosonic Wire Bonding
EFFECTS OF THERMAL AGING ON INTERMETALLIC COMPOUNDS AND VOIDS FORMATION IN AuAl WIRE BONDING
Process windows for low-temperature Au wire bonding
Journal of Electronic Materials, 2004
Microelectronics International, 2010
The effect of Pd and Cu in the intermetallic growth of alloy Au wire
Journal of Electronic Materials, 2003
Bond strength evaluation of heat treated Cu-Al wire bonding
Journal of Mechanical Engineering and Sciences, 2018
Materials Transactions, 2008
Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding
IEEE Transactions on Advanced Packaging, 2005
Fine pitch copper wire bonding process optimization with 33µm size ball bond
2011 IEEE 13th Electronics Packaging Technology Conference, 2011
Study of Ag-alloy wire in thermosonic wire bonding
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 2012
A micromechanism study of thermosonic gold wire bonding on aluminum pad
Journal of Applied Physics, 2010
Effects of Ca on grain boundary cohesion in Au ballbonding wire
Thin Solid Films, 2006
Assessing Au-Al wire bond reliability using integrated stress sensors
2010
Growth of intermetallic compounds in thermosonic copper wire bonding on aluminum metallization
Journal of Electronic Materials, 2010
Microelectronics Reliability, 2011
Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability
IEEE Transactions on Components and Packaging Technologies, 2003
Intermetallic Phase on the Interface of Ag-Au-Pd/Al Structure
Advances in Materials Science and Engineering, 2014
MRS Proceedings, 2006
Some thoughts on bondability and strength of gold wire bonding
Gold Bulletin, 2012
Correlation between electrical resistance and microstructure in gold wirebonds on aluminum films
Microelectronics Reliability, 1991
Crystals, 2013