Low profile silicon photonics packaging approach featuring configurable multiple electrical and optical connectivity (original) (raw)

8th IEEE International Conference on Group IV Photonics, 2011

Abstract

ABSTRACT A package solution for silicon photonic integrated circuits with multiple input/output grating-based optical interfaces is proposed and experimentally demonstrated. The approach is based on using a subassembly sub-mount carrier to maintain standard-compatible lateral orientation for the fibers in the package.

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