Copper deposition by dynamic chemical plating (original) (raw)
Effects of additives and chelating agents on electroless copper plating
Applied Surface Science, 2001
In this study, ethylenediaminetetraacetic acid (EDTA), triethanolamine (TEA), and ethylenediamine (En) were adopted herein as additives or chelating agents in electroless copper plating, with formaldehyde as the reduction agent. Linear sweep voltammetry was successfully applied to analyze the potential shift of copper complexes and the adsorption capability of chelating agents on a surface. Moreover, the grain size and surface roughness of copper were investigated using atomic force microscopy (AFM). The experimental results for a dual-chelating-agent system indicated that EDTA plays an important role in chelating, while the main effect of TEA is adsorption on copper surfaces to inhibit formaldehyde oxidation. Meanwhile, ethylenediamene is a prominent re®ning agent owing to its markedly higher adsorption strength on copper surfaces than formaldehyde and TEA. The analyses including linear sweep voltammetry, AFM, and XRD are effective to explore the effect of chelating agents and additives on electroless copper plating and deposits.
International Research Journal of Science, Technology, Education, and Management, 2023
In the present research work, a new environment friendly electroless copper plating process, copper coating has been successfully achieved on acrylonitrile butadiene styrene (ABS) plastics by using a typical alkaline bath solution. A durable bright copper deposition on the ABS plastic was studied by the non-electrolytic process using alkaline copper(II) nitrate bath and gold chloride activator. The electroless copper plating was carried out by studying the impact of different factors such as variation of bath concentration, variation of plating time and variation of temperature. The optimum conditions of smooth surface coverage of quality grade coating were found to be plating time of 15 min, concentration of copper(II) nitrate as 2% (w/v) and the temperature of 60 2 C. This study suggests that electroless copper plating on acrylonitrile butadiene styrene polymers be used for coating applications in engineering, aircraft, oil and gas, construction, electronics, and a number of other fields based on the results achieved. K E Y W O R D S: ABS plastics, Deposition, Electroless plating
Controlling factors affecting the stability and rate of electroless copper plating
Materials Letters, 2004
The purpose of this article is to focus on the electroless copper plating step from tartarate or ethylenediaminetetraacetic (EDTA) baths used in through hole plating (THP) of printed circuit boards (PCBs). The effect of bath operating conditions (temperature, pH and agitation) and bath additives (pyridine, cytosine, thiourea, benzotriazole (BT) and 2-mercaptobenzothiozole (2MBT)) on plating rate, bath stability, morphology and etching rate of the coating has been studied. It has been found that all the organic additives studied except thiourea not only stabilize electroless copper baths but also enhance the plating rate from 1.1 to 1.8 mg/(cm 2 h) in the tartarate bath at 30 jC and from 5.4 to 10.5 mg/(cm 2 h) in the EDTA bath at 50 jC. Mild air agitation increases the bath stability 20 times that of bath without aeration. The additives were found to modify the crystal structure with the production of small grain size, dense, tightly adherent and etching resistant copper deposit.
Electrochimica Acta
Copper electroless plating at low pH (7-9) using dimethylamine borane complex as a reducing agent is studied electrochemically by linear sweep voltammetry, cyclic voltammetry and chronopotentiometry in full electrolytes. We find that the mixed potential theory is not applicable to the described system. We show that both the working potential and the rate-controlling mechanism are dependent on the pH of the solution. The effects of altering the mechanism on the resulting film conductivity, morphology and adhesion are studied on copper films deposited onto a polyimide (PI) substrate.
AFM Studies of the Effect of Chloride Ion on the Morphology of the Copper Electroplating Surface
Optics, 2014
The influence of plating mode, chloride ion on morphology of copper deposits has been studied on pure copper substrate. The electroplating was conducted at 50 , 25°C in cupric sulfate-sulfuric acid bath with various chloride additions 0.001-0.01 ml. The morphology and grain sizes of the electrodeposited copper were examined by atomic force microscopy. The maximum surface roughness and grain sizes of copper deposit were obtained when it was deposited with 0.01 ml of chloride ions. Small particles were observed on the surface of the copper film electroplated with the addition of chloride ions up to the amount of 0.001 ml.
Effects of Plasma Treatment as a Surface Preparation Step on Copper Plating
Academic Perspective Procedia, 2021
The continuous electrolytic copper plating process traditionally includes degreasing and acid baths before copper plating baths. These baths add difficult-to-control parameters to the process. Besides they contain various alkaline chemicals and acids that are harmful to the environment. The plasma surface treatment is a controllable alternative surface cleaning method which is used in various fields. Also it can be used for surface activation to improve plating performance. Another important aspect of the plasma process is its environmental friendliness. It has a high potential to make plating preparation stages environmentally friendly and efficient. In this study a plasma surface treatment system is attached on a traditional copper plating line which is used for cold rolled low carbon steel sheets. It was determined that plasma surface treatment had a positive effect on the quality of copper plating.
Electroless Cu Plating on ABS Plastic by Using Environmentally Friendly Chemicals
Deu Muhendislik Fakultesi Fen ve Muhendislik, 2018
In this study, the electroless copper plating technique was applied on Acrylonitrile Butadiene Styrene (ABS) plastic. The effects of ionic liquid types, plating time and sanding paper size were investigated on plating. Experiments were carried out with two different types of ionic liquids: 1-ethyl-3-methyl imidazolium chloride (EMIC C6H11N2Cl) and 1-ethyl 3-methylimidazolium dicyanamide (DCA, C8H11N5), with 120-500 grit sandpapers by applying sand attrition process, at constant bath temperature as 60⁰C, and with 30-150 minutes of deposition times. The characterization of the coated samples was performed by X-ray Diffraction (XRD) and Scanning Electron Microscopy (SEM). Experimental results show that the copper plating on ABS plastic was succeeded. The maximum amount of deposit was obtained by using EMIC as catalyst with 150 min deposition time and with 500 grit sandpaper size.
Copper-Platinum Deposition by Pulse Plating
Journal of The Electrochemical Society, 2006
In order to improve the mechanical properties of copper, pulse plating techniques were investigated for deposition of Cu-Pt alloys employing a pyrophosphate bath containing chloroplatinic acid as a source of platinum. Cyclic voltammetry experiments showed that the copper reduction is a two-step process and that platinum reduction occurs at potentials close to that observed for copper deposition. Forward peak current densities ranging from 2.5 to 7.5 A dm −2 were employed for the bulk electrodeposition experiments. Bright, shiny, and crack-free deposits were obtained at low current densities. The amount of platinum observed in the deposits was found to increase with the current impressed for both forward pulse and pulse reverse techniques. The Knoop hardness was found to increase with the platinum content of the deposits. The corrosion rate of the deposits measured in a solution of NaCl was found to decrease with platinum content. The data show that deposits containing up to 5.6 and 6.5 wt % of platinum can be obtained by forward pulse ͑only͒ and pulse reverse plating, respectively. As compared to a copper sample, the Cu-Pt deposits obtained by forward pulse and reverse pulse techniques exhibited a 31 and 55.4% increase in Knoop hardness, respectively. As compared to copper, up to a 45.4% increase in corrosion resistance was observed for deposits produced by the application of a forward pulse. The deposits obtained by pulse reverse exhibited a 35.6% improvement in corrosion resistance over those obtained by the forward pulse technique under identical forward peak current density.
Applied Surface Science, 2019
Results of in-depth experimental analysis of the laser-assisted local copper deposition on commercial Polyamide 6 (PA 6) are presented. Pico-and nanosecond lasers were validated for surface modification of the polymer followed by silver (I) activation and finished by autocatalytic electroless copper plating on the laser-modified areas. Detailed investigations were dedicated to finding out the origin of selective metal plating, including the surface profiling and wettability dynamics, XPS analysis and electric resistance measurements of the deposited copper layer. Based on the experimental data, the mechanism of the polymer surface activation by the laser modification is proposed.