Improvement of light output in GaN-based power chip light-emitting diodes with a nano-rough surface by nanoimprint lithography (original) (raw)
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Nanotechnology, 2008
Enhanced light extraction from a GaN-based power chip (PC) of green light-emitting diodes (LEDs) with a rough p-GaN surface using nanoimprint lithography is presented. At a driving current of 350 mA and with a chip size of 1 mm × 1 mm packaged on transistor outline (TO)-cans, the light output power of the green PC LEDs with nano-rough p-GaN surface is enhanced by 48% when compared with the same device without a rough p-GaN surface. In addition, by examining the radiation patterns, the green PC LED with nano-rough p-GaN surface shows stronger light extraction with a wider view angle. These results offer promising potential to enhance the light output powers of commercial light-emitting devices by using the technique of nanoimprint lithography under suitable nanopattern design.
Full wafer scale nanoimprint lithography for GaN-based light-emitting diodes
Thin Solid Films, 2011
A UV-imprinting process for a full wafer was developed to enhance the light extraction of GaN-based green light-emitting diodes (LEDs). A polyvinyl chloride flexible stamp was used in the imprinting process to compensate for the poor flatness of the LED wafer. Two-dimensional photonic crystal patterns with pitches ranging from 600 to 900 nm were formed on the p-GaN top cladding layer of a 2 inch diameter wafer using nanoimprint and reactive ion etching processes. As a result, the optical output power of the patterned LED device was increased by up to 44% at a driving current of 20 mA by suppressing the total internal reflection and enhancing the irregular scattering of photons at the patterned p-GaN surface.
Efficiency Enhancement of GaN-Based Power-Chip LEDs with Sidewall Roughness by Natural Lithography
Electrochemical and Solid-State Letters, 2007
This study reports the development of GaN-based power-chip light-emitting diodes ͑LEDs͒ with sidewall roughness using natural lithography with polystyrene spheres as the etching mask. At an injection current of 350 mA, the LED with sidewall roughness increased the light output intensity of the InGaN/GaN multiple quantum well LEDs by a factor of 1.26, indicating that the LED with sidewall roughness had larger light extraction efficiency. The wall-plug efficiency of GaN-based LED was increased by 26.5% with sidewall roughness. After 1000 h life test, it was found that normalized output power of power-chip LED with sidewall roughness did not show any significant degradation.
Improving the Light-Emitting Efficiency of GaN LEDs Using Nanoimprint Lithography
Recent Advances in Nanofabrication Techniques and Applications, 2011
Taiwan 2. Limits and enhancements of the light-extraction efficiency of GaN LEDs No single semiconductor material alone is capable of emitting white light. A white light LED typically consists of an appropriate mixture of (a) red, blue, and green LEDs, or (b) blue www.intechopen.com Recent Advances in Nanofabrication Techniques and Applications 174 and yellow lights, where the blue LED stimulating yellow phosphor produces the yellow light. In either case, the blue LED is the main constituent of a white light LED. Most blue LEDs are made from GaN, the compound discussed in this paper.
Chinese Physics B, 2010
GaN-based light-emitting diodes (LEDs) with surface-textured indium tin oxide (ITO) as a transparent current spreading layer were fabricated. The ITO surface was textured by inductively coupled plasma (ICP) etching technology using a monolayer of nickel (Ni) nanoparticles as the etching mask. The luminance intensity of ITO surface-textured GaN-based LEDs was enhanced by about 34% compared to that of conventional LED without textured ITO layer. In addition, the fabricated ITO surface-textured GaN-based LEDs would present a quite good performance in electrical characteristics. The results indicate that the scattering of photons emitted in the active layer was greatly enhanced via the textured ITO surface, and the ITO surface-textured technique could have a potential application in improving photoelectric characteristics for manufacturing GaN-based LEDs of higher brightness.
IEEE Photonics Technology Letters, 2000
In this paper, we report the fabrication and characteristics of nano-roughened GaN laser lift-off (LLO) light-emitting diodes (LEDs) with different scale surface roughness. The surface roughness of devices was controlled by inductively coupled plasma reactive ion etching. Using this fabrication method to form nanoscaled roughness, the electrical property was almost not degraded. Furthermore, the light-output power and wall-plug efficiency of LLO LED could be both significantly enhanced about two times using this simple method.
Nanoscale Research Letters, 2017
This study investigates the optoelectronic characteristics of gallium nitride (GaN)-based thin-film light-emitting diodes (TF-LEDs) that are formed by a two-step transfer process that involves wet etching and post-annealing. In the two-step transfer process, GaN LEDs were stripped from sapphire substrates by the laser lift-off (LLO) method using a KrF laser and then transferred onto ceramic substrates. Ga-K nanorods were formed on the surface of the GaN-based TF-LEDs following photo-assisted chemical etching and photo-enhanced post-annealing at 100°C for 1 min. As a result, the light output power of GaN-based TF-LEDs with wet etching and post-annealing was over 72% more than that of LEDs that did not undergo these treatments.
Optics Express, 2007
Light extraction analysis of GaN-based light-emitting diodes (LEDs) with Monte Carlo ray tracing is presented. To obtain high light extraction efficiency, periodic structures introduced on the top surface and/or on the substrate of various types of LED are simulated, including wire bonding, flip chip and Thin GaN. Micro pyramid array with an apex angle from 20 o to 70 o is shown to effectively improve the light extraction efficiency. In addition, for an LED encapsulated within an epoxy lens, the patterned substrate with pyramid array is found to be a more effective way to increase light extraction efficiency than the surface texture.
Selective wet etching of p-GaN for efficient GaN-based light-emitting diodes
IEEE Photonics Technology Letters, 2006
The selective wet etching of a p-GaN layer by using a solution of KOH in ethylene glycol (KE) was studied to enhance the optical and electrical performance of the GaN-based light-emitting diodes (LEDs). The surface of the p-GaN, which was selectively etched in the KE solution, showed hexagonal-shaped etch pits. The light-output power of etched LEDs was improved by 29.4% compared to that of the nonetched LED. This improvement was attributed to the increase in the probability of photons to escape due to the increased surface area of textured surface and the reduction in contact resistance of the ohmic layer resulting from the increased contact area and hole concentration on the textured p-GaN. The reverse leakage current of the LED was also greatly decreased due to the surface passivation and the removal of defective regions from the p-GaN.