An Introduction to application of zebra pattern for dissipation of heat in electronic equipments (original) (raw)

Thermal Analysis of Heat Dissipating Electronic Devices

2016

The rapid increase in the growth and advancement of electronic technology leads to the miniaturization of the devices. As the compactness of the device increases the problem of heat transfer also increases. There is a limitation for the cooling with air in the devices with high heat dissipation. The compactness and limitation in air cooling forces the use of Minichannel and use of liquid coolants. The main aim of this work is to carryout experimentally, the heat transfer analysis of Square Minichannel (used as a heat sink) cooled with RO treated water. The study was conducted under turbulent, steady and forced flow condition. The important parameters of interest like Reynolds’s number, Nusselt number, friction factor, and pressure drop were calculated. From the obtained results, it was clearly observed that within the entry region, both local heat transfers coefficient and friction factor increases and after a short distance it becomes constant. Also with increase in Reynolds number...

A Comparative Study of Heat Energy Dissipated from Electronic Devices by CFD Analysis

Heat sinks are the indigenous thermal management hardware used in electronic applications. These heat sinks will boost up the thermal control of electronic components, assemblies, and modules by enhancing their surface area through the use of fins. Present work is concerned with the comparative study of taper pin fi n heat sink and cylindrical pin fi n heat sink using the commercial CFD software. The heat sink is made from aluminum and air is used as the cooling fl uid and a constant heat fl ux of 100 W/cm 2 from bottom and fl ow velocity of 2m/s. The results showed that for a given boundary conditions, the taper pin fi ns have less temperature gradient i.e., less thermal resistance than cylindrical pin fi ns heat sink which results in increase the rate of heat transfer from fi ns.

Modelling, Thermal Design and Thermal Analysis of an Electronic Unit.

International Journal of Engineering Sciences & Research Technology, 2014

Thermal design and thermal analysis is necessary to effectively and efficiently cool electronic components for its best operation. This cooling method is known as electronic cooling. In the present work a finned heat sink for Electronic Unit (EU) of an Air Vehicle (AV) has been designed using the empirical heat transfer correlations by considering natural convection and radiation heat transfer modes[1] for given heat load. The preliminary calculations indicated that plane surface was inadequate to dissipate the heat, thus necessitating fins to augment the heat dissipation to the ambient. Heat transfer calculations were carried out for finned surface to find out the maximum surface temperature, which is well below the maximum permissible temperature. Further fin space optimization has been made by using empirical correlation for given heat sink to bring down the surface temperature further below.3D modelling of all the parts of the electronic unit was carried out in SolidWorks2012.Using Flo.EFD software the CFD model is generated and analysed to obtain the total thermal mapping of the above electronic unit. The CFD results were used to validate the results obtained through the excel spread sheet program developed based on the empirical correlations available in the literature.

Thermal Performance of Pulsating Heat Stripes Built With Plastic Materials

Journal of Heat Transfer, 2019

A low-cost, flexible pulsating heat pipe (PHP) was built in a composite polypropylene sheet consisting of three layers joint together by selective laser welding, to address the demand of heat transfer devices characterized by low weight, small unit thickness, low cost, and high mechanical flexibility. A thin, flexible, and lightweight heat pipe is advantageous for various aerospace, aircraft, and portable electronic applications where the device weight, and its mechanical flexibility are essential. The concept is to sandwich a serpentine channel, cut out in a polypropylene sheet and containing a self-propelled mixture of a working fluid with its vapor, between two transparent sheets of the same material; this results into a thin, flat enclosure with parallel channels hence the name “pulsating heat stripes” (PHS). The transient and steady-state thermal response of the device was characterized for different heat input levels and different configurations, either straight or bent at dif...

Investigation of thermal effects on textile materials printed by digital printing

This paper presents research of thermal influence on the textile material printed by digital ink jet technique. In the theoretical part of the research we offer overview of relevant research related to surface roughness and the color difference on textile materials which were subjected to thermal load. The parameters of surface roughness before printing, after printing and after various thermal effects were analyzed in experimental part. Thermal effect was analyzed in a given period of time, with thermal imaging camera to obtain surface temperature distribution of the observed sample. The differences in color were analyzed also before and after printing and after various thermal loads. As a reference point the field of 100% of cyan, magenta, yellow and black coverage was taken. For determining the color differences a model CIEDE 2000 was used. SEM analyses of the changes were observed on the surface of textile materials before and after printing and after the thermal effects. The an...