PCB Design Process and Fabrication Challenges (original) (raw)
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We describe the development of a novel vehicle-routing-based algorithm for the optimization of the chip/component placement sequences during an automated assembly of printed circuit boards using high-speed robotic equipment. We carry out sensitivity analyses and equipment re-design studies to determine maximal-impact improvement strategies for manufacturers of such equipment.
Electronic Interconnect � Printed Circuit Board � Manufacturing �
2008
At high bit rates copper tracks in printed circuit boards (PCBs) suffer severe loss and pulse distortion due to radiation of electromagnetic waves, dispersion and bandwidth limitations. The loss can be overcome to some extent by transmitting higher power pulses and by changing the dielectric constant and loss tangent of the PCB substrate material. However, high power pulses consume power and can cause electro-migration which reduces the board lifetime, although the copper tracks can be surrounded by another metal to prevent this at the expense of further processing steps. The use of special board materials can be costly and some materials containing high dielectric constant crystallites can cause poor adhesion. The pulse distortion, dispersion and bandwidth limitations can be overcome to some extent by the use of pulse pre-emphasis and adaptive equalisation at further cost. Electromagnetic waves are radiated efficiently at high bit rates removing power from the track so causing loss...
A web based course on designing high density interconnect PCBs for manufacturability
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), 2000
The design of high density interconnects (HDI) PCBs is an important step in design and development of present day electronic products. This design is becoming a complex task with the availability of a large number of process technologies. Each technology offers its own cost (yield)/volume/performance optimisation. The designer should be able to do the package design in the context of a selected manufacturing technology, and communicate effectively with the fabricator. This process may be termed as "design for manufacturability" (DFM). While DFM issues are not new to an electronicPCB designer, these acquire new importance in the context of proliferation of manufacturing processes and increasing performance requirements. In addition, these issues are in a constant state of flux, as process changes and new processes are being introduced on a continuing basis. Consequently, there is a need for the designer to continuously keep track of process improvements, and take advantage of them to make his product more competitive. This paper presents the structure of a course on "design of HDI PCBs for manufacturability". While it is designed as a second level course on electronic packaging, that can be offered at graduate level. As a larger number of practising engineers are likely to be interested in such a course, it is proposed to make it web based.
DEVELOPING THE SKILL IN PRINTED CIRCUIT BOARD FABRICATION FOR SELF RELIANCE - Ndubuisi Paul D. I.
Printed circuit Board (P.C.B.) is the most popular breadboard with which designed proto-typed electronic circuits are used to implement desired design objectives. Developing the skill in its fabrication process can be an avenue to entrench entrepreneurship leading to self-actualization. This paper presents the techniques that are involved in the development of this skill. To drive home this message, a two stage amplifier circuit is used to demonstrate the technique. If this is strictly studied, followed and applied, it is enough to equip any literate electronics engineering professional and related disciplines with the skill to accomplish P.C.B. fabrication to suit any circuit of one's choice.
Automatic Verification of Design Rules in PCB Manufacturing
Highlights of Practical Applications of Agents, Multi-Agent Systems, and Complexity: The PAAMS Collection, 2018
Nowadays, electronics can be found in almost every available device. At the core of electronic devices there are Printed Circuit Boards (PCB). To create a suitable PCB there is the need of complying with several constraints, both concerning electrical and layout design. Thus, the design rules related to the PCB manufacturing and assembly are very important since these restrictions are fundamental to ensure the creation of a viable physical PCB. Electrical Computer Aided Design (ECAD) tools are able to automatically verify such rules, but they only consider a subset of the total required rules. The remaining rules are currently manually checked, which may increase the occurrence of errors and, consequently, increase the overall costs in designing and in the manufacturing process of a PCB. Being the design a crucial phase in the manufacturing procedure, a software system that automatically verifies all design rules and produce the corresponding assessment report is fundamental. Such software system is addressed in this paper.
PCB DESIGN USING LOCAL TECHNOLOGY AND AutoCAD
Journal of Physics: Conference Series
This paper focuses on the production of printed circuit boards for use with both domestic and industrial electronics. The use of printed circuit board (PCB) design software, methods of design transfer to copper boards, etching and post-production tasks were undertaken and are described in detail in this paper. The relevance of this paper is appreciated for its unique ideas and methods of incorporating local technology into modern PCB design with proven reliability, precision and economic advantages.
Applied Sciences, 2020
New product development (NPD) is a process of interactions among multiple parties. With stronger competition in the electronic product market, reducing NPD cycle time has become a common important subject in the information technology (IT) industry. The main topic of this research is process improvements in the research and development (R&D) department of the case company by studying how product competitiveness can be enhanced in the current rapid proceeding technology industry. The process-oriented and hierarchical structure is used to analyze the processes of a new printed circuit board (PCB) design and test, and then a modified design chain operations reference (DCOR) model is introduced to explore problems and suggest corresponding solutions. This research also specifies a clear design chain structure for the case firm and improves its R&D process by brainstorming. The goal is to increase the case firm’s PCB design chain efficiency by shortening the delivery time and reducing th...
Printed Circuit Structures, the Evolution of Printed Circuit Boards
The Printed Circuit Board (PCB) is the backbone of electronics and a large number of consumer devices. The challenge to put more function in a smaller space requires more components utilizing smaller bond pads, smaller lines and tighter pitch. The electronic packaging industry has aggressively pursued novel ways to shrink and stack multilayer boards inside smaller volumes. Industry is approaching serious obstacles in the continued size reduction requirements with the need for wires, epoxy, vias, solder and sometimes bolts and screws to mount the boards. The next logical step is to move beyond 2D stacking, which is 2.5D to make 3D packages and to utilize the 3 rd dimension directly. Eliminate the traditional 2D FR4 board and the wires, epoxies, vias and solder and make the next generation packages utilizing the 3 rd dimension; the Printed Circuit Structure (PCS). The PCS concept will allow passives, actives and even antennas to move out of the XY plane and into the XZ and YZ planes. This new dimension will appear to be very complex and next generation circuit optimization will be required, but the end result will net a significant improvement in volume utilization. In addition, if new materials are developed and utilized properly, the PCS will be the box or the package thus eliminating all the bolts and screws necessary to mount a PCB in a traditional box or package, thus again saving space and reducing weight. nScrypt and the University of Texas at El Paso will present 3D Printing of Printed Circuit Structures. A demonstration of true 3D electronic structures will be demonstrated and shown as well novel approaches which utilize Computer Aided Design (CAD) to 3D Printing which will include the electronics portion.