X-ray peak profile analysis of crystallite size distribution and dislocation type and density evolution in nano-structured Cu obtained by deformation at liquid nitrogen temperature (original) (raw)

2005, Materials Science and Engineering: A

X-ray peak profile analysis was employed to determine the crystallite size distribution and the evolution of dislocation type and density in pure Cu deformed by rolling at liquid nitrogen temperature for the following rolling reduction levels: 67, 74, 87, and 97%. The results show that as the deformation level increases, the variance and the median of the crystallite size distribution decreases. It was also found that the dislocation density decreases in the first segment of the deformation, and increases slightly after reaching a minimum. This can be explained by the fact that the mobility of the dislocations was limited by the low deformation temperature. In order to reduce the strain energy, the dislocations reorganize themselves into dislocation cell structure, which leads to the reduction of the X-ray coherent domain length. Furthermore, it was established that full dislocations dominate the deformation process at lower deformation levels, when the median of the crystallite size distribution is greater then 50 nm. At higher deformation levels and smaller crystallite size, the fraction of partial dislocations become significant, while the overall dislocation density increases slightly and the population of the full dislocation decreases. It is concluded that the increase in dislocation density is due to the emission of a new generation of partial dislocations, which become the leading deformation mechanism.

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Dislocation densities and character evolution in copper deformed by rolling under liquid nitrogen from X-ray peak profile analysis

Powder Diffraction, 2005

The microstructure evolution in pure copper deformed by rolling at liquid nitrogen temperature was determined by using X-ray diffraction peak profile analysis. The crystallite size distribution and defects evolution were determined as a function of different reduction levels (e.g. 67%, 74%, 87%, and 97%). By using the Multiple Whole-Profile (MWP) fitting procedure the Fourier transforms of the experimental X-ray peak profiles were fitted all at once by theoretical calculated functions. Here it is assumed that the crystallites are spherical shape and have a lognormal size distribution. It is also supposed that the strain broadening of the profiles is caused by <110>{111}-type dislocations. The results show that the median and the variance of the crystallite size distribution decreases as the deformation reduction increases. The dislocation density has a minim value at 74% reduction. The increase of the dislocation density at higher deformation levels is due to the nucleation of new generation of dislocations from the crystallite grain boundaries. It was found that the edge dislocation type is predominating the dislocation network formed during the deformation process.

Microstructures and dislocation configurations in nanostructured Cu processed by repetitive corrugation and straightening

Acta Materialia, 2001

The microstructures and dislocation configurations in nanostructured Cu processed by a new technique, repetitive corrugation and straightening (RCS), were studied using transmission electron microcopy (TEM) and high resolution TEM. Most dislocations belong to 60°type and tend to pile up along the {111} slip planes. Microstructural features including low-angle grain boundaries (GBs), high-angle GBs, and equilibrium and non-equilibrium GBs and subgrain boundaries were observed. Dislocation structures at an intermediate deformation strain were studied to investigate the microstructural evolutions, which revealed some unique microstructural features such as isolated dislocation cell (IDC), dislocation tangle zones (DTZs), and uncondensed dislocation walls (UDWs).

Dislocation structure and crystallite size in severely deformed copper by X-ray peak profile analysis

Materials Science and Engineering: A, 2005

Copper specimens were severely deformed by equal channel angular pressing (ECAP) up to eight passes. The microstructure was studied by X-ray diffraction peak profile analysis as a function of strain (ε). It was found that the crystallite size is reduced to a few tens of nanometers already at ε = 0.7 and it does not change significantly during further deformation. At the same time, the dislocation density increases gradually up to ε = 4. The dipole character of the dislocation structure becomes stronger with increasing strain. The thermal stability of the microstructure is examined by differential scanning calorimetry (DSC). The temperature of the DSC peak related to the recovery of the microstructure decreases with increasing strain. At the beginning of the heat release, a bimodal grain structure develops indicated by a special double-peak shape of the diffraction line profiles.

Microstructure Evolution in Deformed Copper and Nickel

MRS Proceedings, 2006

ABSTRACTThe combined effect of strain and temperature on the microstructure and detailed internal structure of dislocation boundaries was systematically studied in compressed pure polycrystalline copper and nickel and compared to the microstructure of compressed polycrystalline aluminum. Below 0.5Tm the microstructure of Cu and Ni consists of dislocation cells, however, only in Cu second generation microbands are formed. In Cu and Ni, the dislocations inside the boundaries rearrange themselves from tangles to ordered arrays of parallel dislocations following interplay between strain (requirement for cross slip) and temperature (dislocation mobility and ease of cross slip). The ordered detailed structure is similar to that observed in Al deformed at room temperature and lower strain levels. The amount of strain and temperature applied to Cu and Ni in order to achieve the same detailed structure formed in Al depends on the stacking fault energy (SFE) of the metal- higher strain and te...

Densities and character of dislocations and size-distribution of subgrains in deformed metals by X-ray diffraction profile analysis

The density and the character of dislocations and the size-distribution of grains or subgrains were determined by a new procedure of X-ray diffraction (XRD) profile analysis in copper specimens deformed by equal channel angular pressing (ECA) or cold rolling. The anisotropic strain broadening of diffraction profiles was accounted for by dislocation contrast factors. The screw or edge character of dislocations was determined by analyzing the dislocation contrast factors. Three size parameters and the dislocation density were obtained by the modified Williamson– Hall and Warren– Averbach procedures. Assuming that the grain-size distribution is log-normal, the median, m, and the variance, |, of the size distribution of grains or subgrains were obtained from these three size parameters.

Scanning X-ray diffraction peak profile analysis in deformed Cu-polycrystals by synchrotron radiation1This work is dedicated to Professor Dr Guenther Schoeck on the occasion of his 70th birthday.1

Acta Materialia, 1999

AbstractÐDensities and arrangements of dislocations and mesoscopic long-range internal stresses in coldrolled polycrystalline copper were determined in scanning mode by X-ray peak pro®le analysis with synchrotron radiation. The high brilliance enabled the use of a focal spot of less than 50 mm. The diraction pro®les of the 200 re¯ections were measured by scanning the specimen step by step in front of the beam. In this way, the heterogeneities of the deformation-induced microstructure within single grains were obtained. At small deformations including stage III, the dislocation densities and the internal stresses were uniform within the grain interior, but larger near the grain boundaries where the dislocations showed a tendency to form stress-intensive arrangements. At higher deformations towards and in stage IV, the dislocation density and the internal stresses increasingly¯uctuated within the whole grain. The¯uctuations were interpreted as the transformations of polarized dipolar dislocation walls (PDW) into polarized tilt walls (PTW) observed recently by macroscopic diraction experiments on highly deformed specimens. These results are important for the current research of strengthening processes in stage IV. #

Quantitative description of plastic deformation in nanocrystalline Cu: Dislocation glide versus grain boundary sliding

Physical Review B, 2008

Uniaxial plastic deformation of polycrystalline Cu with grain sizes in the range of 5-20 nm was studied by using molecular dynamics computer simulations. We developed a quantitative analysis of plasticity by using localized slip vectors to separate the contributions of dislocation activity from grain boundary sliding. We conclude that the competition between these two mechanisms depends on strain rate and grain size, with the dislocation activity increasing with grain size but decreasing with increasing strain rate. For samples with a 5 nm grain size, dislocations contribute Ϸ50% of the total plastic strain during steady state deformation at a rate of 1 ϫ 10 8 s −1 , but this fraction decreases to 35% at a rate of 1 ϫ 10 10 s −1. When the grain size is increased to 20 nm, dislocations account for 90% of the strain, even at 1 ϫ 10 10 s −1. During the initial stages of plastic deformation, grain boundary sliding initially decreases with strain owing to strain-induced relaxation processes within the grain boundaries. The grains also rotate a few degrees during straining to 20%; the rate of rotation ͑per unit strain͒ slightly decreases with strain rate. Lastly, we computed the amount of forced atomic mixing during plastic deformation. The mean square separation distance between atom pairs within grain interiors increases with strain at a rate proportional to their distance apart ͑i.e., the mixing is superdiffusive͒, but for pair separations greater than the grain size, this rate becomes independent of the separation distance.

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