The re-evaluation of mechanical properties of wire bonding (original) (raw)

2011 International Symposium on Advanced Packaging Materials (APM), 2011

Muhammad Zulkifli

Norinsan Kamil Othman

Azman Jalar

Shahrum Abdullah

Abstract

Page 1. 226 The Re-Evaluation of Mechanical Properties of Wire Bonding Azman Jalar a , Muhammad Nubli Zulkifli a , Norinsan Kamil Othman b and Shahrum Abdullah c a Institute of Microengineering and Nanoelectronic (IMEN), ...

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