A general approach for the analysis of finite size PCB ground planes (original) (raw)

IEEE International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.00CH37016), 2000

Abstract

The analysis of the current distribution on ground planes of printed circuit boards is carried out by means of a very efficient dual approach and compared with numerical results. The current density inside ground planes of finite thickness is also analytically determined and the per unit length parameters evaluated

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