A low power X-band CMOS differential VCO (original) (raw)

A clonal selection algorithm with varying order finite elements for the optimization of microwave devices

Microwave and Optical Technology Letters, 2008

A real-coded clonal selection algorithm (RCSA), which is a global search method based on the artificial immune systems paradigm, is applied for optimizing microwave devices. We couple RCSA with varying high-order finite elements (FEs) to control the balance between the global and local search efforts in the algorithm. In this scheme, low-order FEs are used in the global search, whereas varying high-order FEs are used in the local search. The proposed technique is investigated in the designs of an E-plane miter bend and a rectangular waveguide impedance transformer. The results illustrate the accuracy and computational savings of this method. © 2008 Wiley Periodicals, Inc. Microwave Opt Technol Lett 50: 1392–1397, 2008; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.23387

Design of a 4.2–5.4 GHz differential LC VCO using 0.35 μm SiGe BiCMOS technology for IEEE 802.11a applications

International Journal of Rf and Microwave Computer-aided Engineering, 2007

In this paper, a 4.2–5.4 GHz, −Gm LC voltage controlled oscillator (VCO) for IEEE 802.11a standard is presented. The circuit is designed with AMS 0.35 μm SiGe BiCMOS process that includes high-speed SiGe Heterojunction Bipolar Transistors (HBTs). According to post-layout simulation results, phase noise is −110.7 dBc/Hz at 1 MHz offset from 5.4 GHz carrier frequency and −113.4 dBc/Hz from 4.2 GHz carrier frequency. A linear, 1200 MHz tuning range is obtained from the simulations, utilizing accumulation-mode varactors. Phase noise was also found to be relatively low because of taking advantage of differential tuning concept. Output power of the fundamental frequency changes between 4.8 dBm and 5.5 dBm depending on the tuning voltage. Based on the simulation results, the circuit draws 2 mA without buffers and 14.5 mA from 2.5 V supply including buffer circuits leading to a total power dissipation of 36.25 mW. The circuit layout occupies an area of 0.6 mm2 on Si substrate, including DC and RF pads. © 2007 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2007.