Quasi-optical technique for sensing bond quality of silicon wafers (original) (raw)

Micro-Optics 2010, 2010

Abstract

ABSTRACT In this paper, we investigate a novel fast and reliable method to check the bonding quality of silicon wafers. It is based on illuminating the wafers with a high frequency waves (110 - 170 GHz) using quasi-optical technique. The reflected energy is used to evaluate the bonding strength. The reported experimental study is compared with the Infrared images.

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