In-line TEM sample preparation and wafer return strategy for rapid yield learning (original) (raw)

Metrology, Inspection, and Process Control for Microlithography XX, 2006

Abstract

Full wafer dual beam FIB-SEM systems have received a lot of industrial interest in the last years and by now are operational in several 200mm and 300mm fabs. These tools offer a 3D-physical characterization capability of defects and device structures and as such allow for more rapid yield learning and increased process control. Moreover, if SEM resolution is insufficient to

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