Implementation of an External Intelligent Cooling System for Laptops using TECs (original) (raw)
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Global journal of computer science and technology, 2015
A major problems in the operation of laptop computers is overheating since it can affect the performance and stability, sometimes leading to system crash and hardware fatality. The objective of this work was to study the thermal behavior inside a laptop computer and to test the effectiveness of aproposed cooling method to overcome overheating problem. The proposed cooling system contained a thermoelectric device that reduced the intake air temperature into the laptop internal cooling system. An external exhaust blower, located at the exhaust air outlet of the laptop, was mounted to ensure sufficient air flow rate delivered by the cooling system. To assess the effectiveness of the system, temperatures of critical components in the computer were measured. It was found from the study that, under extreme utilization situation, the temperature of the graphic processing unit could increase to 99°C. The proposed cooling system could bring down the temperature by up to 6°C.
Thermal cooling enhancement of dual processors computer with thermoelectric air cooler module
Case Studies in Thermal Engineering, 2019
The thermal cooling enhancement technique of dual processors workstation computer couple thermoelectric air cooler module is studied experimentally. The monitored parameters mainly focus on the computer load conditions, with and without thermoelectric air cooler module, cooling fan turns on/off modes, and different cooling fan sizes. In experiment process, the working computer load of 0-100% is performed. The temperature distribution inside the computer chassis depends on the density, position of the components inside the computer both active and passive components. It is found that the thermoelectric air cooler module has a significant effect on the air and the CPU temperatures of the dual processor computer. In addition, the operating modes, positions and sizes of the cooling fan have significant effect on air distribution inside the computer chassis. However, energy consumption is also increased. The results of this study are expected to lead to guidelines that will allow the design of the cooling system with improved heat transfer performance of the electronic equipment.
A major problems in the operation of laptop computers is overheating since it can affect the performance and stability, sometimes leading to system crash and hardware fatality. The objective of this work was to study the thermal behavior inside a laptop computer and to test the effectiveness of aproposed cooling method to overcome overheating problem. The proposed cooling system contained a thermoelectric device that reduced the intake air temperature into the laptop internal cooling system. An external exhaust blower, located at the exhaust air outlet of the laptop, was mounted to ensure sufficient air flow rate delivered by the cooling system. To assess the effectiveness of the system, temperatures of critical components in the computer were measured. It was found from the study that, under extreme utilization situation, the temperature of the graphic processing unit could increase to 99°C. The proposed cooling system could bring down the temperature by up to 6°C. Abstract-A major problems in the operation of laptop computers is overheating since it can affect the performance and stability, sometimes leading to system crash and hardware fatality. The objective of this work was to study the thermal behavior inside a laptop computer and to test the effectiveness of aproposed cooling method to overcome overheating problem. The proposed cooling system contained a thermoelectric device that reduced the intake air temperature into the laptop internal cooling system. An external exhaust blower, located at the exhaust air outlet of the laptop, was mounted to ensure sufficient air flow rate delivered by the cooling system. To assess the effectiveness of the system, temperatures of critical components in the computer were measured. It was found from the study that, under extreme utilization situation, the temperature of the graphic processing unit could increase to 99°C. The proposed cooling system could bring down the temperature by up to 6°C.
Laptop Cooling Pad Temperature Monitoring System
Indonesian Journal of Electrical Engineering and Computer Science, 2018
Cooling pads are commonly used to reduce temperature of laptop to avoid overheating problem. However, existing cooling pads are prone to various limitations: fixed voltage in the hardware component, inaccurate temperature readings and lacked of computer-based temperature monitoring functions. In this paper, a laptop cooling system with multivoltage fan speed controller using real-time processor temperature readings is proposed. A graphical user interface (GUI) and color coded LEDs are also implemented to provide visual inspection of the temperature values captured from the laptop. The temperature values are displayed in graph and tabular form. The performance of the proposed cooling pad with computer-based monitoring application is evaluated against two other types of existing cooling pad systems. The experiments have shown that the temperature values can be monitored clearly with the proposed GUI. More importantly, the proposed cooling pad system has the potential to achieve lowe...
Implementation of Thermoelectric Cooling Chip Cooling Fan System
https://www.ijrrjournal.com/IJRR\_Vol.7\_Issue.7\_July2020/Abstract\_IJRR0040.html, 2020
The traditional electric fan in summer, the wind blowing out is hot. In this study, thermoelectric cooling chips are used to cool the water. Then use the pump to put the ice water into the cold exhaust and blow out the cold air with a fan to achieve the effect of cooling the air.
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The impact of ongoing progress in Science and Technology has created variety of systems that can be used in producing of refrigeration effect with the use of thermoelectric module and photovoltaic module for generation of energy in which we further use for cooling and heating effect. The most important utilization of this portable air cooler is for to deliver cold air. A Thermoelectric module (Peltier Module) is used instead of refrigeration system (VCC or VAC cycle). The most important utilization of this air cooler is for to deliver cold air. A Thermoelectric module (TEM) is used as it is based on the principles of Peltier effect. The use ofPeltier effect is to create heating side and cooling side and also to maintain effectiveness. Thermoelectric Air cooler (TEAC) is a solid state heat pump in which uses the components that are available commercially. The thermoelectric refrigerator does not produce chlorofluorocarbon (CFC). It is pollutant free-contains no liquids or gases, portable, compact, creates no vibration or noise because of the difference in the mechanics of the system. It is a prototype and its semiconductor materials, by Peltier effect, to provide instantaneous cooling or heating. It has the advantage of having no moving parts and thus maintenance free.
Sustainable Self-Cooling Framework for Cooling Computer Chip Hotspots Using Thermoelectric Modules
Sustainability
The heat generation from recent advanced computer chips is increasing rapidly. This creates a challenge in cooling the chips while maintaining their temperatures below the threshold values. Another challenge is that the heat generation in the chip is not uniform where some chip components generate more heat than other components. This would create a large temperature gradient across the chip, resulting in inducing thermal stresses inside the chip that may lead to a high probability to damage the chip. The locations in the chip with heat rates that correspond to high heat fluxes are known as hotspots. This research study focuses on using thermoelectric modules (TEMs) for cooling chip hotspots of different heat fluxes. When a TEM is used for cooling a chip hotspot, it is called a thermoelectric cooler (TEC), which requires electrical power. Additionally, when a TEM is used for converting a chip’s wasted heat to electrical power, it is called a thermoelectric generator (TEG). In this s...
Review on Development of Thermoelectric Air cooler
International Journal for Research in Applied Science & Engineering Technology (IJRASET), 2022
With rising global temperatures leading to an increase in average temperatures throughout the year making people living in areas with high power outages very busy and difficult. As a modern cooling system that combines Coolers and Airconditioners does not work in the inverter for energy-saving purposes which makes them useless thus during high temperature hours. Therefore, in terms of combating the problem with portability, savings and cost-effectiveness in the concept of another climate it uses TEC while using the grid and recharging. Although it is common knowledge that the efficiency of TEC cooperation is low compared to the air-cooled air cooler used today but with advanced production techniques and forced delivery of cold liquid that increase effective device cooling and humidity control using humidity. suction and capillary tube as a heat sink to reduce heat in the hot sink instead of air fin to reduce the surrounding heat radiation. Basically in this study we tried to increase the performance coefficient of Peltier Module using various techniques. The module also does not save energy, so over time we will not be able to use many or two or three and we need to create a cooling effect. So we keep everything in mind using the right module to achieve the goal and make it a mass production model.
Prevention of Overheating of Electronic Devices Using IoT Based Temperature Controlled Fan
Now-a-days the usage of electronic devices became more and more popular. This usage of electronic device for long time in-turn leads to increase in the temperature of the device which makes the device overheat. Overheating causes internal damage to the corresponding device and hence reduces the life time of the device. So, to control the heat and protect the electronic device from overheating, an IoT based temperature Controlled fan is proposed. The main objective is to detect the temperature of the device when in use using temperature sensor and automatically making the fan ON and OFF based on the measured temperature. When the temperature is greater than the set value or the threshold value, the fan will be in ON condition by which the high temperature of the device gets reduced. An Arduino board is used to implement this. Making the electronic device free from overheating, decreases the chance of damage done and increase the lifetime of the device.
Thermal devices integrated with thermoelectric modules with applications to CPU cooling
2005
Over the past few years, the air cooling technology improvements present diminishing returns for microprocessors cooling applications. Presently most of the proposed future cooling technologies (i.e. pumped liquid cooling or vapor compressor refrigeration) may need some fluid moving device and a large remote heat exchanger which requires additional volume. Due to the complexity, reliability issues and space requirements it is preferred to extend the air cooling within the current form factors and using passive devices. This paper will show that optimized thermoelectric modules combined with two-phase (liquid/vapor) passive devices can further improve the cooling capability compared to conventional air cooling technologies at reasonable thermoelectric cooler (TEC) power consumption. Current computational fluid dynamics programs are not yet well equipped to find out the most optimized TEC geometry (for a given COP and given thermal requirements) in a reasonable amount of computation time. Therefore, two modeling steps are proposed: find out the preliminary TEC geometry using an 1D analytical program (based on uniform heat flux and a given COP) and use it as an input to CFD programs (i.e. Icepak®) for detailed predictions. Using this model, we confirmed that the conventional TEC technology must use some spreading device to dissipate the CPU heat to the TEC cold side. Different spreading devices are considered: solid metal, heat pipe, vapor chambers and single/two phase pumped cooling. Their individual performance integrated with TEC will be presented. In addition, we propose that the TEC performance to be controlled as a function of instantaneous CPU power consumption, ambient temperature and other parameters. This controller offers extra flexibility which can be used for either noise reduction or TEC power reduction. However, such power cycling of the TEC may affect the TEC reliability. Power cycling accelerated test data (>500,000 accelerated cycles) have been performed together with the life predictions will be presented in the paper.