Enhanced Cooling of Laptop Computer for Improvement of Processing Performance Enhanced Cooling of Laptop Computer for Improvement of Processing Performance (original) (raw)
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Enhanced Cooling of Laptop Computer for Improvement of Processing Performance
Global journal of computer science and technology, 2015
A major problems in the operation of laptop computers is overheating since it can affect the performance and stability, sometimes leading to system crash and hardware fatality. The objective of this work was to study the thermal behavior inside a laptop computer and to test the effectiveness of aproposed cooling method to overcome overheating problem. The proposed cooling system contained a thermoelectric device that reduced the intake air temperature into the laptop internal cooling system. An external exhaust blower, located at the exhaust air outlet of the laptop, was mounted to ensure sufficient air flow rate delivered by the cooling system. To assess the effectiveness of the system, temperatures of critical components in the computer were measured. It was found from the study that, under extreme utilization situation, the temperature of the graphic processing unit could increase to 99°C. The proposed cooling system could bring down the temperature by up to 6°C.
On the thermal cooling of central processing unit of the PCs with vapor chamber
International Communications in Heat and Mass Transfer, 2012
An experimental investigation on the thermal cooling of vapor chamber for cooling computer processing unit of the personal computer is performed. Two different configurations of the vapor chambers with de-ionized water as working fluid are tested under the real operating conditions of PCs. Parametric studies including different aspect ratios, fill ratios, and operating conditions of PC on the CPU temperature are considered. It was found that the vapor chamber cooling technique has significant effect on the thermal cooling of CPU. Average CPU temperatures obtained from the vapor chamber cooling system are 4.1%, 6.89% lower than those from the conventional cooling system for no load and 90% operating loads, respectively. In additional, this cooling system requires 6.89%, 10.53% lower energy consumption for no load and 90% operating loads, respectively. The results of this study are of technological importance for the efficient design of cooling systems of the personal computers or electronic devices to enhance cooling performance.
Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)
The trend of the processor performance and heat dissipation increased significant every year. In the year 2000, the clock speed of processor used in notebook is marginal 1GHz and heat dissipation marginal 20 W, but in the current year 2003 the processor's clock speed is higher than 2 GHz and heat dissipation higher than 50 W and approaching 100 W by year 2004. Heat dissipation increased but in contrary the size of the processor reduced and thus the heat flux is critically high. The heat flux is about 10-15 W/cm2 in the year 2000 and could reach over 100 W/cm2 by year 2004. The purpose of this paper is to provide overview of various cooling solutions using heat pipe and vapor chamber for cooling high power processors in a confined space of the notebook.
Thermal cooling enhancement of dual processors computer with thermoelectric air cooler module
Case Studies in Thermal Engineering, 2019
The thermal cooling enhancement technique of dual processors workstation computer couple thermoelectric air cooler module is studied experimentally. The monitored parameters mainly focus on the computer load conditions, with and without thermoelectric air cooler module, cooling fan turns on/off modes, and different cooling fan sizes. In experiment process, the working computer load of 0-100% is performed. The temperature distribution inside the computer chassis depends on the density, position of the components inside the computer both active and passive components. It is found that the thermoelectric air cooler module has a significant effect on the air and the CPU temperatures of the dual processor computer. In addition, the operating modes, positions and sizes of the cooling fan have significant effect on air distribution inside the computer chassis. However, energy consumption is also increased. The results of this study are expected to lead to guidelines that will allow the design of the cooling system with improved heat transfer performance of the electronic equipment.
HEAT TRANSFER ANALYSIS ON LAPTOP COOLING SYSTEM BEFORE AND AFTER INTRODUCING A COOLER AT EXHAUST
IRJET, 2023
This project uses CATIA and SolidWorks tools to do a thermal analysis and cooling system optimisation of a laptop microprocessor. The aim of the study is to evaluate the ability of the heat pipe, heat sink, and VGA fan to dissipate heat under various operating conditions. The laptop's complex solid model was created using the CATIA software, whereas the SolidWorks software was put to use for the thermal analysis. The results show that the cooling system can effectively dissipate heat produced by the microprocessor, and that the thermal performance is affected by elements like airflow rate and thermal conductivity of the materials used in the heat sink. After the result of these studies, a new cooler is developed and fitted to the previous system in order to further improve thermal efficiency, or the capacity to dissipate heat. This minute change has a significant impact on the laptop's ability to dissipate heat. This research will be helpful in the design and development of new cooling systems for electronic devices which are similar to laptops.
EXPERIMENTAL ANALYSIS OF LIQUID COOLING SYSTEM FOR DESKTOP COMPUTERS
A simple liquid cooling system for a desktop computer has been designed. Different types of cooling systems were studied and compared. Liquid cooling system was found to be most effective in terms of performance but not in terms of design, cost and reliability. A simple, economical and reliable liquid cooling system was thus designed. Measurements of the temperature distributions of the system have also been made. Computer CPU usage was varied to determine the maximum, minimum and average cooling requirements and identify critical areas of heat trapping. The liquid cooling system was implemented in the desktop. Experimental and theoretical investigations of different heat sources inside a computer system have been made. An investigation of the optimum cooling condition for the computer the thermal performance of this simple liquid cooling system for a desktop computer have been made.
Comparison Analysis of Liquid and Air-cooling Systems for GPU
International Journal for Research in Applied Science & Engineering Technology (IJRASET), 2022
In order to increase reliability and prevent early failure, heat produced by electronic components and circuits must be drained. Heat sinks, fans, and other air-cooling devices, as well as alternative computer cooling methods like liquid cooling, can all be used as heat dissipation techniques. Here the paper's main focus is on a numerical analysis of temperature distribution in a GPU scenario with various input velocity circumstances, including v = 1 m/s, 3 m/s, and 5 m/s. Air and water are the two distinct fluids employed in this investigation to cool the graphics card. An analysis of the fluid flow and heat transfer simulation of a desktop graphics card heat sink is conducted using the CFD software ANSYS Fluent. According to the findings, cooling with water was 10% more effective than cooling with air. The outcome also shows an inverse correlation between the graphic card chip's intake velocity and temperature. The rate of heat transfer to the heat sink increases as the inflow velocity rises which is helped by the convection.
Numerical Study on Heat Propagation in Laptop Cooling System
Journal of Advanced Research in Fluid Mechanics and Thermal Sciences
Thermal management of microelectronic devices has become increasingly important to maintain their performance and prolonging the lifespan of the devices. In this study, numerical simulation has been conducted to investigate the heat propagation for high performance microelectronic device of laptop. Two models are constructed and Ansys Fluent is used for the Computational Fluid Dynamics (CFD) simulation, source term is applied at the heat source, heat sink and two different material heat pipes are the main cooling components in the system. The results show that the improved design model is a better design for laptop cooling systems, and the increasing number of air vents, thermal conductivity, and length of heat pipes can effectively cool the high-powered microchip effectively. Transient simulation, considering the wick structure and working fluid in the simulation, is suggested for future work.