In Situ Microassembly (original) (raw)
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Methods and Characterization of Pick and Place Microassembly
Microelectromechanical Systems, 2006
Microassembly of MEMS structures using serial pick-andplace has been demonstrated as a method for constructing complex three-dimensional microstructures. A new methodology to perform pick-and-place microassembly using a 3 DOF micromanipulator is demonstrated here. In this approach, the "pick" operation is performed on one chip, while the "place" operation is performed on a second chip mounted orthogonally to it under a microscope. This removes the need for the rotation of parts during assembly as required in previous works thus creating a significantly simpler assembly process. Also new in this work is the characterization of the contact resistance and the rigidity of assembled microstructures. The contact resistance of assembled microparts coated with 30nm of gold is measured to be approximately 12Ω using a four-point measurement. The force required to pull out a micropart from a socket (into which it is assembled) is characterized along all three axes and found to be over 5mN in each case. The relationship between the force taken to engage the sockets and the force to pull out a micropart is measured to be linear. An electrostatic inchworm motor with extended range and a vertical thermal actuator are demonstrated which are manufactured using microassembly. Thus this assembly process with mechanically rigid assemblies is shown to have a number of potential applications.
Microassembly Technologies for MEMS
1998
Microassembly promises to extend MEMS beyond the confines of silicon micromachining. This paper surveys research in both serial and parallel microassembly. The former extends conventional "pick and place" assembly into the micro-domain, where surface forces play a dominant role. Parallel assembly involves the simultaneous precise organization of an ensemble of micro components. This can be achieved by microstructure transfer between aligned wafers or arrays of binding sites that trap an initially random collection of parts. Binding sites can be micromachined cavities or electrostatic traps; short-range attractive forces and random agitation of the parts serve to fill the sites. Microassembly strategies should furnish reliable mechanical bonds and electrical interconnection between the micropart and the target substrate or subassembly.
Self-assembly of microsystem components with micrometer gluing pads through capillary forces
Journal of Manufacturing Processes, 2020
The self-alignment of microparts based on capillary forces and micrometer adhesive pads was evaluated through experimental evidence, analytical modelling and simulation. The local deposition of adhesive pads in the range of 2000 to 20 μm was realized by photo-lithographical patterning of an acrylate adhesive interlayer, followed by the spontaneous assembly with glass counterfaces that have a complementary array of hydrophobically modified gold structures. The design rules for self-alignment of microparts were studied from calculations of the capillary force and displacement as a function of the adhesive pad dimensions, pad heights and offset length. In all cases, the self-alignment induced by capillary forces is driven by a minimization of the surface energy, leading to an equilibrium position. The analytical results provided good qualitative understanding of the alignment process: larger dimensions, smaller separation and higher offset values contributed to higher forces and fast alignment. The simulation experiments in Surface Evolver were based on calculated geometries of adhesive pad providing a minimum surface energy and also take into account the local deformation of the adhesive pad together with an additional degree of rotational freedom. Consequently, the latter results indicated a high degree of precision with good correlation to the experiments and analytical results.
Parallel assembly of microsystems using Si micro electro mechanical systems
Microelectronic Engineering, 2003
The remarkable advances in miniaturization have been achieved largely by the monolithic integration techniques developed by the integrated circuit industry. However, monolithic integration frequently results in compromised performance and for complete systems frequently there is ''some assembly required''. Assembly is typically an expensive procedure that is carried out serially either by human hands or by automated machinery. However, with the growing demand for microsystems, there is an opportunity to drastically reduce assembly costs by arraying both the parts and microsystems, so that parallel assembly can be used. This paper describes an approach to parallel assembly that makes use of silicon micro electro mechanical systems that should achieve low assembly costs while maintaining high precision and a clear path to downscaling.
Journal of Microelectromechanical Systems, 2007
This paper describes a packaging concept for precise hand-assembly of microelectromechanical systems (MEMS) subsystems that uses mesoscaled deep-reactive ion etching (DRIE) patterned passive deflection spring clusters. The method is intended for applications that require decoupling of subsystem process flows to simplify device fabrication in order to attain macro three-dimensionality, or for cases where the device requires spatially referenced macro-and microfeatures with good precision. The design considerations for the deflection springs are presented, and a simple reduced-order model of the expected elastic behavior is proposed. The assembly concept is demonstrated with an electrospray array test structure. This test structure assembles perpendicularly two wafer substrates. The performance of the test structure is benchmarked using finite-element simulations and by measurements of the misalignment introduced by the assembly. A floor for the ultimate alignment accuracy of the assembly concept is proposed. [1456] Index Terms-Deep-reactive ion etching (DRIE) patterned springs, low-pressure low-temperature die-level packaging, out-of-plane wafer assembly, passive deflection spring assembly, system integration. I. INTRODUCTION, GOAL, AND MOTIVATION M ICROELECTROMECHANICAL systems (MEMS) take advantage of the set of technologies developed by the semiconductor industry. In the majority of cases, these technologies imply the deposition or removal of layers of material where a planar layout is directly involved via a photolithographic process [1], [2]. The use of in-plane layouts to build structures restricts the range of geometries that can be implemented as part of a micromachine, in particular the aspect ratio and three-dimensionality of MEMS parts. Most of the efforts for photolithographic processes focus on reduction of Manuscript
Cirp Annals-manufacturing Technology, 2000
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2007 IEEE International Conference on Automation Science and Engineering, 2007
This paper describes the algorithm development and experimental results of a multi-probe micro-assembly system. The experimental testbed consists of two actuated probes, an actuated die stage, and vision feedback. The kinematics relationships for the probes, die stage, and part manipulation are derived and used for calibration and kinematics-based planning and control. Particular attention has been focused on the effect of adhesion forces in probe-part and partstage contacts in order to achieve grasp stability and robust part manipulation. By combining pre-planned manipulation sequences and vision based manipulation, repeatable spatial (in contrast to planar) manipulation and insertion of a submillimeter part has been demonstrated. The insertion process only requires the operator to identify two features to initialize the calibration, and the remaining tasks involving part pickup , manipulation, and insertion are all performed autonomously.
Two-Dimensional Fiber Positioning and Clamping Device for Product-Internal Microassembly
Journal of Microelectromechanical Systems, 2000
In this paper, we present a microelectromechanical systems-based two-degrees-of-freedom positioning device combined with a clamping structure for positioning and constraining an optical fiber. The fiber position can be controlled in the two directions perpendicular to the fiber axis using two specifically designed wedges that can be accurately moved in-plane. These wedges are positioned using in-plane thermal actuators. Actuation of a fiber tip greater than 25 µm in-plane and 40 µm out-of-plane is achieved with a displacement resolution better than 0.1 µm. After aligning the fiber the final position can be maintained by switching off the mechanical clamp, which also uses thermal actuators. The position of the fiber can be kept within 0.1 µm after switching off the mechanical clamp and the positioning actuator. Fiber-to-fiber alignment experiments have been performed and the technique can be extended to fiber-to-laser alignment.