Microminiature packaging and integrated circuitry: The work of E. F. Rent, with an application to on-chip interconnection requirements (original) (raw)

International Journal of Computer Integrated Manufacturing

International Journal of Computer Integrated Manufacturing, 2003

Full terms and conditions of use: http://www.informaworld.com/terms-and-conditions-of-access.pdf This article may be used for research, teaching and private study purposes. Any substantial or systematic reproduction, redistribution , reselling , loan or sub-licensing, systematic supply or distribution in any form to anyone is expressly forbidden. The publisher does not give any warranty express or implied or make any representation that the contents will be complete or accurate or up to date. The accuracy of any instructions, formulae and drug doses should be independently verified with primary sources. The publisher shall not be liable for any loss, actions, claims, proceedings, demand or costs or damages whatsoever or howsoever caused arising directly or indirectly in connection with or arising out of the use of this material.

Making Micrologic: The Development of the Planar IC at Fairchild Semiconductor, 1957–1963

IEEE Annals of the History of Computing, 2000

The modern integrated circuit evolved from developments at Fairchild Semiconductor during the late 1950s and early 1960s. Using information from laboratory notebooks, internal company memoranda, oral histories, and personal communications, this article reconstructs and analyzes the activities of the Fairchild development team, including the company's efforts to improve and market ICs during the early 1960s.

Computer-integrated design and manufacture of integrated circuits

… and Manufacture of …, 1995

A release of ERNI 1.0 is expected during spring 1997 with extensions supporting hierarchical designs and utilizing higher-performance circuit simulation engines to be released by summer 1997. 2.1.2 Modeling of Advanced Device Structures Project Staff Yonald Chery, Professor Carl V. Thompson, Professor Donald E. Troxel 2.1.1 Modeling of Interconnect Reliability Recent research has demonstrated interconnect failure due to electromigration effect to be strongly dependent not only on current density but also on metal film crystal grain size distribution and geometries of interconnect patterns. This type of failure

Packaging Technology for IBM'S Latest Mainframe Computers (S/390/ES9000)

… , 1991. Proceedings., 41st, 2002

The IBH system 390JES9000 mainframe computers, models 820 and 900, are significantly enhanced by a revolutionary set of packaging materials. These new materials, glass ceramic and copper conductors, were developed over the last decade and integrated into the pioneering ...