A scheme of array memory stacking to the multi-channel solid state disk (SSD) applications: High speed, high reliability, and green compliance (original) (raw)

2008 58th Electronic Components and Technology Conference, 2008

Abstract

In this paper, a construction of 3D array memory module based on chip-on-film (COF) bonding and carrier stacking is developed. Experimental results are demonstrated on an 1.8" HDD-identical platform, where the total thickness of the stacked 3D array memory module of 8 chips X 8 layers is less than 2 mm at 1.8"-HDD area. All materials to implement this 3D

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