Thermo-Fluidic Characterizations of Multi-Port Compact Thermal Model of Ball-Grid-Array Electronic Package (original) (raw)
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Microelectronics Reliability
Delphi-like boundary condition independent (BCI) compact thermal models (CTMs) are the standard for modelling single die packages. However their extraction, particularly in the transient case, will be time consuming due to complex numerical simulations for a large number of external conditions. Lately, new approaches to extract a BCI dynamical CTM (DCTM), based on model order reduction (MOR) were developed. Despite the numerous advantages of this recent method, the lack of numerical tools to integrate reduced-order models (ROM) makes it difficult to use at board level. In this study, a novel process flow for extracting Delphi-inspired BCI DCTMs is proposed. Thus a detailed three-dimensional model is replaced by a BCI-ROM model using FANTASTIC matrix reduction code to generate the data used in the creation of a Delphi-style BCI DCTM. That hybrid reduction method has been applied, at first on a single-chip package (QFN16) then on a dual-chip package (DFN12). Their derived CTM and DCTM have been compared in term of accuracy and creation time using, or not, MOR reduction technique. The results show that for a similar accuracy, the integration of MOR technique allows minimizing the time-consuming numerical simulations and consequently reduce the thermal network creation time by 80%.
Compact electro-thermal models of semiconductor devices with multiple heat sources
2004
The thermal management of semiconductor devices and systems becomes crucial as the power consumed by chips is increasing. For manufacturers it is important to enable the customer to simulate the thermal performance of semiconductor packages at different ambient conditions and arbitrary transient loading conditions. As simulation speed in this case is crucial, compact thermal models are of great importance. In the present work, a new approach to generate compact thermal models of semiconductor packages on PCBs is presented. The main difference from conventional RC-like thermal networks is that the compact model is obtained through a formal model reduction procedure. Model reduction starts with an accurate high-dimensional thermal model created with a finite element program like ANSYS. A low-dimensional model is obtained in such a way that the first moments of the transfer function are the same as in the original model. A model of a semiconductor device with multiple heat sources is used in order to compare this method with a thermal RC network approach. Temperature response results to user defined loading conditions are also compared.
Compact Thermal Networks for Modeling Packages
IEEE Transactions on Components and Packaging Technologies, 2004
In this paper, thermal networks for modeling packages are rigorously introduced. A multipoint moment matching method for state space reduction of these discretized thermal networks is formulated. In this manner reduced thermal networks are derived that can be used as boundary condition independent compact thermal models of packages. This algorithm is successfully applied to the detailed analysis of an idealized ball grid array package. Index Terms-Ball grid array (BGA) package, modeling, packages, thermal networks.
Development of Compact Thermal-Fluid Models at the Electronic Equipment Level
Journal of Thermal Science and Engineering Applications, 2012
The introduction of compact thermal models (CTM) into computational fluid dynamics (CFD) codes has significantly reduced computational requirements when representing complex, multilayered, and orthotropic heat generating electronic components in the design of electronic equipment. This study develops a novel procedure for generating compact thermal-fluid models (CTFM) of electronic equipment that are independent over a boundary condition set. This boundary condition set is estimated based on the information received at the preliminary design stages of a product. In this procedure, CFD has been used to generate a detailed model of the electronic equipment. Compact models have been constructed using a network approach, where thermal and pressure-flow characteristics of the system are represented by simplified thermal and fluid paths. Data from CFD solutions are reduced for the compact model and coupled with an optimization of an objective function to minimize discrepancies between detailed and compact solutions. In turn, an accurate prediction tool is created that is a fraction of the computational demand of detailed simulations. A method to successively integrate multiple scales of electronics into an accurate compact model that can predict junction temperatures within 10% of a detailed solution has been demonstrated. It was determined that CTFM nodal temperatures could predict the corresponding area averaged temperatures from the detailed CFD model with acceptable accuracy over the intended boundary condition range. The approach presented has the potential to reduce CFD requirements for multiscale electronic systems and also has the ability to integrate experimental data in the latter product design stages.
Evaluation of analytical models for thermal analysis and design of electronic packages
Microelectronics Journal, 2003
The objective of this study is to evaluate the use of several analytical compact heat transfer models for thermal design, optimization, and performance evaluation in electronic packaging. A model for heat spreading in orthotropic materials is developed. The developed model is used in conjunction with the other available heat transfer models in a resistance network for calculation of heat transfer rate and junction temperatures in a multi-chip module (MCM). Refrigeration cooled MCM of an IBM server is used to illustrate the methodology. Results of the analytical model and resistance network analysis are compared with a numerical solution. Capability of the analytical model in predicting the thermal field is discussed and effectiveness of using the analytical models in thermal design and optimization of electronic packages is demonstrated. q
2004
This paper presents an approach of compact thermal modeling-HotSpot, which is parameterized according to design geometrical dimensions and material physical properties. While most existing compact thermal modeling methods facilitate thermal analysis of existing package designs, our modeling method is more suitable for the exploration of new designs at both the die level and the package level due to its physically-based parametrization characteristics. Although it may not be as "compact" as other modeling approaches, our approach provides much more thermal information of the design, especially at the die level, with negligible computational overhead. We also show that our modeling method achieves reasonable boundary condition independence (BCI) by comparing it with a DELPHI compact thermal model for a benchmark BGA chip under the same set of boundary conditions.
IEEE Transactions on Components and Packaging Technologies, 2000
In this paper, a model reduction technique is applied to the thermal modeling of electronic components and devices with complex geometries. The reduced-order model is capable of predicting a complete detailed three-dimensional temperature distribution in the original model. The small size and the simplicity of the reduced model allows for the very quick simulation of the device under a wide range of input parameters, such as different boundary conditions and power distributions. Use of the reducedorder model in a thermal design cycle can have a significant effect on both prediction accuracy and simulation efficiency. In the paper, the usefulness of this technique is demonstrated through examples from different electronic devices and packages. Accuracy of the reduced-order model is validated by comparison with the solution to a detailed numerical model.
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We present a parameterized macromodeling approach to perform fast and effective dynamic thermal simulations of electronic components and systems where key design parameters vary. A decomposition of the frequency-domain data samples of the thermal impedance matrix is proposed to improve the accuracy of the model and reduce the number of the computationally costly thermal simulations needed to build the macromodel. The methodology is successfully applied to analyze the impact of layout variations on the dynamic thermal behavior of a state-of-the-art 8-finger AlGaN/GaN HEMT grown on a SiC substrate.
A study of compact thermal model topologies in CFD for a flip chip plastic ball grid array package
IEEE Transactions on Components and Packaging Technologies, 2001
A previously validated detailed model of a 119-pin flip-chip plastic ball grid array (FC-PBGA) package was created and validated against experimental data for natural convection and forced convection environments. Next, two compact models were derived, a two-resistor model (created using the JEDEC-standard based computational approach), and a multiresistor model (created using the DELPHI optimization approach that was boundary condition independent within engineering accuracy). The compact models were placed in natural convection and forced convection (velocities of 1 and 2 m/s) environments with and without a heatsink. Based on the agreement obtained between the detailed model and compact model simulations, the accuracy and validity of the two compact models was assessed. Of the two compact thermal models considered, the Delphi multiresistor model provided the same predictive estimates (within 5%) as simulations involving a detailed thermal model of the package in natural and forced convection environments both with and without attached heatsinks. Some thermal modeling issues were addressed with respect to implementation of compact thermal models with attached heatsinks.