The impact of semiconductor packaging technologies on system integration an overview (original) (raw)

2009, 2009 Proceedings of ESSCIRC

AI-generated Abstract

The paper discusses the evolution of semiconductor packaging technologies, highlighting the transition from traditional methods like Surface Mount Technology (SMT) to innovative approaches such as Ball Grid Array (BGA) and its 3D variants. It emphasizes the challenges and limitations these technologies face, particularly in the context of miniaturization and system integration for modern applications like mobile devices. The overview presents the necessity for new concepts combining conventional assembly and wafer processes, positioning the future of semiconductor packaging at the intersection of performance, cost-effectiveness, and integration capabilities.