Crosstalk analysis of interconnection lines and packages in high-speed integrated circuits (original) (raw)
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Crosstalk and transient analyses of high-speed interconnects and packages
IEEE Journal of Solid-State Circuits, 1991
This paper presents a new method for the crosstalk and transient analyses of lossy interconnects with arbitrary termination circuits. In order to analyze an interconnect containing N signal conductors, we first derive closed-form formulas to determine its transfer functions, and then apply the inverse Fourier transform to obtain its time-domain pulse response functions. Two types of equivalent circuit models can be formulated once the pulse response functions of the interconnect are found. The circuit schematics of the models depend on the number of the signal conductors, irrespective of the physical parameters of the interconnect. These models are compatible with standard circuit simulation tools since they consist of linear resistive networks and linear-dependent sources only. Two example circuits are studied to examine the accuracy and efficiency of the present method.
Crosstalk analysis of high-speed interconnects and packages
IEEE Proceedings of the Custom Integrated Circuits Conference
This study develops closed-form formulas for determining the voltage and current transfer functions and waveforms of N coupled interconnects with arbitrary linear termination impedances. Besides providing valuable insight into coupling phenomenon, the formulas facilitate accurate computation of noise and waveform distortion due to crosstalk.. Sarkar," Multiconductor transmission lines in multilayered dielectric media", IEEE Trans. Microwave Theory Tech.,
Crosstalk analysis for high-speed pulse propagation in lossy electrical interconnections
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1993
The effects of interconnection loss (both dc loss and skin effect loss) on crosstalk noise for a coupled lossy interconnection system, with various termination conditions, coupled lengths, spacings, and interconnection structures (microstrip lines versus strip lines) are investigated. Fourier transform techniques and numerical methods are applied to solve the coupled transmission line equations for the strong coupling case (mutual coupling between the active line and the quiet line). The interconnection is either terminated by its approximated matched load impedance, R,, or by the equivalent loading capacitance of the receiver, C L. General design guidelines for controlling the crosstalk noise and reflection noise in lossy interconnections are discussed.
The effect of risetime upon pulse shape and crosstalk in high speed digital interconnection
A lossy model for microstrip lines has been implemented in the SPICE simulator to in¨estigate the effect of rise time of an input signal upon the output wa¨eforms. The le¨el of ringing and pulse deformation are found to be related to the fast rise time gi¨en the circuit layout and parameters. The limits to the speed and pulse width of an input signal ha¨e been predicted for appropriate logic functions.
Spectral Models for the Estimation of Delay and Crosstalk in High-Speed Interconnects
IEEE Transactions on Electromagnetic Compatibility, 2000
In this paper, a closed-form rational model is presented for the computation of the finite ramp response of multiconductor transmission lines, which allows the numerical estimation of delay and crosstalk of coupled dispersive and lossy interconnects. The proposed method is based on the closed-form dyadic Green's function of the 1-D wave-propagation problem and allows to incorporate inductive as well as dispersive effects in a straightforward way. The proposed solution is obtained by combining the state-space models of the interconnect and terminations with no restriction as to the number of poles and nature of interconnect or terminations. The methodology is tested by comparison of the results with those obtained by using the Spice solver, the standard transmission-line theory and the inverse Fourier transform as well as lumped network models.
The effect of rise time upon pulse shape and cross talk in high-speed digital interconnects
Microwave and Optical Technology Letters, 1997
A lossy model for microstrip lines has been implemented in the SPICE simulator to in¨estigate the effect of rise time of an input signal upon the output wa¨eforms. The le¨el of ringing and pulse deformation are found to be related to the fast rise time gi¨en the circuit layout and parameters. The limits to the speed and pulse width of an input signal ha¨e been predicted for appropriate logic functions. ᮊ 1997
Signal integrity analysis of high-speed interconnects through a full-wave transmission line model
Proceedings - 9th IEEE Workshop on Signal Propagation on Interconnects, SPI 2005, 2005
This paper brings out a novel method for reducing Near end and Far end Crosstalk using Electromagnetic Band Gap structures (EBG) in High Speed RF transmission lines. This work becomes useful in high speed closely spaced Printed Circuit Board (PCB) traces connected to multi core processors. By using this method, reduction of-40dB in Near-End Crosstalk (NEXT) and-60 dB in Far End Crosstalk (FEXT) is achieved. The results are validated through experimental measurements. Time domain analysis is performed to validate the signal integrity property of coupled transmission lines.
Parameterized models for crosstalk analysis in high-speed interconnects
2009 IEEE International Symposium on Electromagnetic Compatibility, 2009
We present a new parametric macromodeling technique for lossy and dispersive multiconductor transmission lines (MTLs), that is suitable to interconnect modeling. It is based on a recently introduced spectral approach for the analysis of lossy and dispersive MTLs extended by utilizing the Multivariate Orthonormal Vector Fitting (MOVF) technique to build parametric macromodels in a rational form. They can handle design parameters, such as substrate or geometrical layout features, in addition to frequency. The presented technique is suited to generate state-space models and synthesize equivalent circuits, which can be easily embedded into conventional SPICE-like solvers. Parametric macromodels allow to carry out design space exploration, design optimization and crosstalk analysis efficiently. A numerical example validates the proposed approach in both frequency and time domain and is focused on the crosstalk analysis.
Proceedings. 45th Annual IEEE Symposium on Foundations of Computer Science, 2004
Signal Integrity (SI) losses in the interconnects are the disturbances coming out of their distributed nature of parasitic capacitances, resistances, and inductances at high frequency operation . SI losses are further aggravated if multiple interconnect lines couple energy from, or to each other. Therefore, this paper aims to analyze the cross-talk coupling effects between the two interconnects, namely the aggressor and victim lines, using the ABCD two-port network model. In order to reduce the simulation time a reduced order modeling of the interconnect line is considered. Furthermore, as stated in various literatures [7] the rising (or falling) input signal represented by a simple step function is not accurate enough, therefore in this paper the rising transitions and the falling transitions are represented more accurately using the exponential terms, and based on such input representation the time domain output signal voltage in presence of crosstalk noise, at the far end side of both aggressor line and victim line, is determined. Such output voltage representation is very helpful in estimating the delay, overshoot or undershoot etc., which are believed to cause SI losses in the SoC.