Experimental and CFD investigation of commercial PC heat sink performance using water and nanofluids (original) (raw)
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CFD Analysis of Liquid-Cooled Heatsink Using Nanofluids in Computer Processors
Scientia Iranica
In this study, a computer model of the Zalman ZM-WB3 Gold heat exchanger which is one of the liquid-cooled computer processors in the market has been generated and the model has been confirmed by the previous researchers' models and experimental data. Then, the fin thickness and heights of the same heat exchanger and the type of liquid fluid in which the heat exchanger operates have been changed. The CFD analyzes of the new models were performed by using Ansys Fluent 17.1 program. Following that, nano heat removal (cooling) performances were investigated with models using rectangular fin fluid heat exchangers with different fin heights of 5 mm, 5.5 mm and 5.7 mm, and different fin thicknesses of 1.2 mm, 1.4 mm, 1.6 mm, 1.8 mm and 2 mm, and different fluids as water, copper oxide-water (CuO-H 2 O) nanofluids with volume ratios of 2.25% and 0.86%, and graphene oxide (GO-H 2 O) nanofluid with the volume ratio of 0.01%. It was concluded that the best CPU cooler performance could be achieved by using CuO-H 2 O as nanofluid with a volumetric ratio of 2.25% with a heat exchanger that has a 5.5 mm fin height and 2.0 mm fin thickness.
Challenges in Nano and Micro Scale Science and Technology, 2019
This paper experimentally studies the heat absorption performance of a heat sink with vertical embedded heat pipes in the aluminium blade. The cooling system with embedded heat pipes distributes heat from the CPU to both the base plate and the heat pipes, and then transfer heat from fins to the Environment. The thermal resistance and heat transfer coefficient are evaluated for natural convection under steady state condition, by changing the heat input from 25W to 100 W. the heat pipe is filled distilled water, Ethylene Glycol, Ethanol, Ethylene glycol distilled water solution, copper oxide/ water Nano-fluid (Cu/H2O) with different weight percentage. The results indicate that the presence of copper oxide/ water Nano-fluid in heat pipe increase heat transfer in a computer CPU cooling system and reduce the thermal resistance of the pipe rather than other fluids. In fact, use of nanofluids removes heat transfer significantly in CPU cooling systems and can be a good replacement for the common working fluid in this device.
Comparison of the Performance of Copper Oxide Nanofluid with Water in Electronic Cooling
Journal of ASTM International, 2012
A numerical study to compare the performance of water and copper oxide (CuO) nanofluid flowing under laminar regime in a parallel-plate channel, serving as a heat sink in an electronic device, has been presented. The geometry considered here is commonly used in the design of heat sinks suitable for cooling an array of microprocessor chips for which air cooling is insufficient. The influence of nanofluids concentration on local and average skin friction coefficients, Nusselt numbers, and convective heat-transfer coefficients in the channel have been analyzed in detail. The increases in the skin friction and heat transfer with volumetric concentration of nanoparticles have been evaluated from numerical simulations in the Reynolds number range of 100 to 2000. The analysis shows that the flow in this heat sink is hydrodynamically and thermally developing, for which the axial variations of local skin friction and local Nusselt number are presented. As an example, computational results for an 8 % volumetric concentration of CuO nanofluid shows that at a Reynolds number of 2000, the average heat-transfer coefficient increases nearly by a factor of 2 in comparison with pure water. From a detailed analysis summarized in , it is observed that there is an increase in the pressure loss as the particle concentration increases. For the CuO nanofluid of dilute concentration of 2 %, a slightly higher pumping power of about 10 % compared to water is predicted. This may be tolerable for the thermal protection of expensive electronic chips, in applications where the chip cost is the dominant factor.
International Journal of Advance Research, Ideas and Innovations in Technology, 2019
Due to the reduction in the size of the electronic components, heat dissipation has become a major problem. In many cases, air cooling has failed to provide the required demands. The invention of nanofluid has promised to increase the efficiency of the liquid cooling system. The addition of solid nanoparticles to the liquid actually increases the thermal conductivity of the liquid because of the higher thermal conductivity of the solid particles. In this work, the thermal performance of a minichannel heat sink was analyzed using CFD for cooling of processor chipset using nanofluids instead of pure water. The effect of different mass flow rates and various volume concentrations of nanoparticles on the overall thermal performance are also analyzed. The Alumina and graphene water nanofluids are used as coolants with volume concentrations of 0.1, 0.15 and 0.2%. The cooling fluid is made to flow through an Aluminium mini channel with height 5mm and width 1mm respectively. The maximum allowable temperature that has to be maintained at the chip is below 50oC. By using the liquid cooling system with a heat sink, this temperature is reduced as low as 41.22oC. There is also an enhancement of the convective heat transfer coefficient in using graphene nanofluids when compared to alumina nanofluids. The thermal resistance of the heat sink with nanofluids is lesser than pure water.
Nanomaterials, 2019
A modern computer generates a great amount of heat while working. In order to secure appropriate working conditions by extracting the heat, a specific mechanism should be used. This research paper presents the effect of nanofluids on the microchannel heat sink performance of computer cooling systems experimentally. CeO2, Al2O3 and ZrO2 nanoparticles suspended in 20% ethylene glycol and 80% distilled water are used as working fluids in the experiment. The concentration of the nanoparticles ranges from 0.5% to 2%, mass flow rate ranges from 0.028 kg/s to 0.084 kg/s, and the ambient temperature ranges from 25 °C to 40 °C. Regarding the thermal component, parameters such as thermophysical properties of the nanofluids and base fluids, central processing unit (CPU) temperature, heat transfer coefficient, pressure drop, and pumping power have been experimentally investigated. The results show that CeO2-EG/DW, at a concentration of 2% and a mass flow rate of 0.084 kg/s, has with 8% a lower temperature than the other nanofluids and with 29% a higher heat transfer coefficient compared with the base fluid. The Al2O3-EG/DW shows the lowest pressure drop and pumping power, while the CeO2-EG/DW and ZrO2-EG/DW show the highest. However, a slight increase of pumping power and pressure drop can be accepted, considering the high improvement that the nanofluid brings in computer cooling performance compared to the base fluid.
Performance Analysis of Electronics Cooling using Nanofluids in Microchannel Heat Sink
International Journal of Engineering and Technology, 2016
Performance analysis of thermal enhancement for cooled microchannel heat sink (MCHS) using nanofluidsmathematical formulation was investigated and presented in this paper. Heat transfer capability in terms of thermal conductivity, heat transfer coefficient, thermal resistance, heat flux and required pumping power were evaluated on the effectiveness of copper oxide (CuO), silicon dioxide (SiO 2) and titanium dioxide (TiO 2) with water as a base fluid. The results showed that thermal performance augmented by 12.2% in thermal conductivity at particle volume fraction of 4% to CuO-water nanofluid, 11.8% for SiO 2-water and 10.0% for TiO 2-water. The maximum heat transfer coefficient enhances of 12.4% for CuO, SiO 2 is 8.22% and 7.4% for TiO 2 with the same inlet velocity of 3 m/s. The addition of nanoparticle concentration significantly enhances the heat transfer, but elevates the expenses of higher required pumping power to increase the pressure drop. The maximum enhancement of heat flux in CuOwater was found to be 2575 kW/m 2 , 2501 kW/m 2 for SiO 2-water and 2485 kW/m 2 for TiO 2-water nanofluid at 4% of volume fraction. The pressure drop is increased with the mass flow rate of 1021 kg/m3 for CuO-water at 0.5% of volume fraction and 47925 Pa to 54314 Pa pressure drop at 4% of volume fraction. The CuO-water pumping power was found to be the highest at 4% of volume fraction with 102.3 W at 3 m/s inlet velocity compared to SiO 2 and TiO 2 also increased the pumping power of 75.0 W to 90.6 W with increasing volume fraction and pressure drop. The positive thermal results implied that CuOnanofluid is a potential candidate for future applications in MCHS.Further analysis is recommended to be done with various Reynolds number, pumping power and flow rate of nanoparticles to obtain better heat transfer performance of cooling fluids.
Thermal Science, 2019
Water cooled heat sinks are becoming popular due to increased heat generation inside the microprocessor. Timely heat removal from microprocessor is the key factor for better performance and long life. Heat transfer enhancement is reached either by increasing the surface area density and/or by altering the base fluid properties. Nanoparticles emerge as a strong candidate to increase the thermal conductivity of base fluids. In this research, the thermal performance of mini-channel heat sinks for different fin spacing (0.2 mm, 0.5 mm, 1 mm, and 1.5 mm) was investigated numerically using CuO-water nanofluids with volumetric concentration of 1.5%. The numerical values computed were than compared with the literature and a close agreement is achieved. We recorded the minimum base temperature of chip to be 36.8?C for 0.2 mm fin spacing heat sink. A reduction of 9.1% in base temperature was noticed using CuO-water nanofluids for 0.2 mm fin spacing as compared to previously experimental estim...
Cascade Straight Heat Pipe for Computer Cooling System with Nanofluid
International Journal of Technology
Computer Central Processing Unit (CPU) technology is being developed rapidly for better work performance together with smaller size. This technology development produces significant heat flux increase on the processor. In this paper, a cascade straight heat pipe (CSHP) is created for a better CPU cooling system which is a fully passive system using nanofluids and hybrid nanofluid as the working fluid. Heat loads were given to the CSHP at 10 watts, 20 watts, 30 watts, and 40 watts, respectively. Based on the experiment's result, the CSHP with Al2O3-TiO2-water working fluid showed the best performance, decreasing 41.872% of the simulator plate temperature at maximum load while also having the highest condenser output temperature. The CSHP with Al2O3-water working fluid decreased 35.243% of the simulator plate temperature. The CSHP with water working fluid decreased only 28.648% of the simulator plate temperature and had the lowest condenser output temperature. The CSHP with Al2O3-TiO2-water showed the lowest thermal resistance and the highest coefficient of heat transfer.
International Communications in Heat and Mass Transfer, 2013
For improvement in information technology (IT), removing heat from electrical devices is an important factor, and current activities try to investigate (numerically, experimentally) new methods of thermal load managing. Mini-channel liquid cooling is one of the candidates for this purpose. Nanofluid as an innovative heat-transfer fluid was used in mini-channel heat sink. Modeling analyzed in this study is a mini-channel heat sink with 20 × 20 mm bottom. For this purpose, five nanoparticle volume fractions namely 0.8, 1.6, 2.4, 3.2 and 4% in five inlet velocities for both types of nanoparticle containing TiO 2 and SiC were used. Furthermore, effect of a nanoparticle volume fraction on the convective heat transfer coefficient was investigated in different Reynolds numbers. Modeling results were compared with reference analytical calculations. In addition according to the modeling results, correlated equations were obtained for Nusselt number and friction factor, and its accuracies were acceptable.
6th International Conference on Mechanical, Industrial and Energy Engineering (ICMIEE), 2020
In the last few decades, a significant amount of technological advancements had occurred in computer systems. Such advancements primarily focused on performance increases and capabilities of the CPUs, which results in development of high heat fluxes and temperature. High temperature can damage the electrical components; therefore, cooling systems are necessary to design to optimize performance. Modern CPUs use air-cooling systems to regulate the temperature. However, the air-cooling system is not the most efficient heat dissipation system available and it also faces some problems due to space limitations. Nowadays high-performance liquid cooling systems imperative of modern technologies are widely being used in the CPU cooling process. In this regard, a comparative investigation is performed using finite volume based numerical simulation for conjugate heat transfer analysis of the CPU cooling system using both air and liquid cooling processes. For liquid cooling, water and nanofluids are used. Nanofluids are currently being a solution for more efficient heat transfer. In this study, CuO-Water nanofluid and Al2O3-Water nanofluid both with volume fraction of 0.5% and 2.0% are used as coolants. Results show that for the maximum flow rate, the maximum temperature difference was around 0.22K between water and 2% CuO-Water nanofluid. For the same mass flow rate, water has the heat transfer coefficient 1758.936 W/m 2 K and 2% Al2O3-water nanofluid has 1804.039 W/m 2 K. Heat transfer coefficient for 2% CuO-Water nanofluid is 1818.093 W/m 2 K for a certain Reynolds number. The thermal resistance of 0.5% CuO-Water is 1.54%, 0.5% Al2O3-water nanofluid is 0.7% and 2% Al2O3-water nanofluid is 2.75% less than water. Therefore, the results show that, nanofluid coolant performed better than the conventional air cooling in terms of improving the heat conductivity. It was also found that increasing the volume concentration resulted in better heat transfer characteristics. The numerical results are found to be encouraging and provide a future scope for designing a better nanofluid based cooling system for CPUs.