Deformation behaviour of paper and board subjected to moisture diffusion (original) (raw)
International Journal of Solids and Structures
This paper presents a method to predict the through-thickness moisture content distribution and associated induced deformations of paper and cardboard sheets as they are subjected to relative humidity changes. The transient moisture diffusion problem is solved using a “natural” analytic approach that has previously been applied for solving transient heat conduction in multi-layer solids. The deformation behaviour of the sheet during the moisture diffusion process is predicted using a semi-analytical approach based on a Rayleigh–Ritz minimization of the total potential energy. Geometrically nonlinear effects are taken into account. Curvatures of the originally flat sheet are predicted as a function of time, as are the shapes of the sheet for steady-state condition. As multiple solutions exist, stability is studied. The developed model was used to study the deformation behaviour of one paper and two cardboard sheets. Comparisons with finite-element results demonstrate that the develop...
Sign up for access to the world's latest research.
checkGet notified about relevant papers
checkSave papers to use in your research
checkJoin the discussion with peers
checkTrack your impact
Loading Preview
Sorry, preview is currently unavailable. You can download the paper by clicking the button above.