P2.1.22 The ubiquitous technology for prototype and disposable bio-chemical sensors packaging (original) (raw)
2012, Proceedings Imcs 2012
A new packaging process for silicon-based chemical sensor arrays has been develop using semiconductor, thick film, and flip-chip technologies. Passive sensors are fabricated on silicon in a semiconductor process compatible with the incorporation of on-chip electronics. Sensor-specific polymer membranes are screen-printed directly onto individual electrode sites. Substrates with flow channels are made from glass using semiconductor process technology. Sensor chips are mounted onto the substrate using a flip-chip approach in which the fluid channels are sealed with a polymer gasket. Electrical contacts between the chip and substrate are made through conductive epoxy bumps. Conductors are brought out to the edge of the substrate; where they are accessible to the next level of system interconnect through a standard board-edge connector.
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