Thermal Management Roadmap Thermal Management Roadmap Cooling Electronic Products from Cooling Electronic Products from Hand Hand--Held Devices to Supercomputers Held Devices to Supercomputers (original) (raw)
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Advanced Cooling Technologies for Microprocessors
International Journal of High Speed Electronics and Systems, 2006
Recent trends in processor power for the next generation devices point clearly to significant increase in processor heat dissipation over the coming years. In the desktop system design space, the tendency has been to minimize system enclosure size while maximizing performance, which in turn leads to high power densities in future generation systems. The current thermal solutions used today consist of advanced heat sink designs and heat pipe designs with forced air cooling to cool high power processors. However, these techniques are already reaching their limits to handle high heat flux, and there is a strong need for development of more efficient cooling systems which are scalable to handle the high heat flux generated by the future products. To meet this challenge, there has been research in academia and in industry to explore alternative methods for extracting heat from high-density power sources in electronic systems. This talk will discuss the issues surrounding device cooling, from the transistor level to the system level, and describe system-level solutions being developed for desktop computer applications developed in our group at Stanford University.
Thermal performance and key challenges for future CPU cooling technologies
2005
Over the past few years, thermal design for cooling microprocessors has become increasingly challenging mainly because of an increase in both average power density and local power density, commonly referred to as "hot spots". The current air cooling technologies present diminishing returns, thus it is strategically important for the microelectronics industry to establish the research and development focus for future non air-cooling technologies.
Cooling Performance of Heat Sinks Used in Electronic Devices
MATEC Web of Conferences, 2018
Existing passive cooling solutions limit the short-term thermal output of systems, thereby either limiting instantaneous performance or requiring active cooling solutions. As the temperature of the electronic devices increases, their failure rate increases. That’s why electrical devices should be cooled. Conventional electronic cooling systems usually consist of a metal heat sink coupled to a fan. This paper compares the heat distribution on a heat sink relative to different heat fluxes produced by electronic chips. The benefit of adding a fan is also investigated when high levels of heat generation are expected.
Thermal Issues in Next-Generation Integrated Circuits
IEEE Transactions on Device and Materials Reliability, 2004
The drive for higher performance has led to greater integration and higher clock frequency of microprocessor chips. This translates into higher heat dissipation and, therefore, effective cooling of electronic chips is becoming increasingly important for their reliable performance. In this paper, we systematically explore the limits for heat removal from a model chip in various configurations. First, the heat removal from a bare chip by pure heat conduction and convection is studied to establish the theoretical limit of heat removal from a bare die bound by an infinite medium. This is followed by an analysis of heat removal from a packaged chip by evaluating the thermal resistance due to individual packaging elements. The analysis results allow us to identify the bottlenecks in the thermal performance of current generation packages, and to motivate lowering of thermal resistance through the board-side for efficient heat removal to meet ever increasing reliability and performance requirements.
Cooling Computer Chips with Cascaded and Non-cascaded Thermoelectric Devices
Arabian Journal for Science and Engineering, 2019
Thermoelectric devices are currently being used in cooling and generating electricity applications. This study mainly focuses on using thermoelectric devices for both applications towards cooling down computer chips; especially, that the very large scale integration technology has reached high advancement where more than 100 million transistors can be fabricated in 1 mm 2. Reducing the non-uniformity of the chip temperature is important so as to decrease the induced thermal stress in this chip and consequently reduce its failure rate. To simultaneously reduce both the non-uniformity of the temperature distribution in the chip and the power requirements for the cooling system, thermoelectric generators can be installed on the cooler chip areas to harvest electrical power from the chip wasted heat. Thereafter, the chip hotspot areas are cooled down using thermoelectric coolers that are powered by the harvested electrical power from the thermoelectric generators in order to maintain the temperatures of these hotspots to be less than or equal a certain temperature threshold. Because no additional electrical power requirement is needed to cool down the hotspots, this cooling technique is called in this paper as "sustainable self-cooling framework for cooling chip hotspots". However, the question is that can the harvested electrical power by the thermoelectric generators be enough to power the thermoelectric coolers for different computer chips at a given operating condition? As such, one of the objectives of this paper is to develop a three-dimensional numerical and optimization model to predict the thermal and electrical performance of cascaded and non-cascaded thermoelectric generators and cascaded and non-cascaded thermoelectric coolers for cooling chip applications. Then, validate the developed model against experimental data. The results showed that the predictions of the developed model were in good agreement with the experimental to within ± 4%. After gaining confidence in the developed model, it was used for a given chip operating condition to conduct a case study for a sustainable self-cooling framework in order to answer the raised question above. The results showed that the self-cooling framework can successfully cool down the hotspot at an acceptable temperature with not only no need for additional electrical power requirements but also for reducing the non-uniformity in the chip temperature distribution.
Study and optimization of advanced heat sinks for processors
2019
The main task of this project is the development of a modular heat exchanger to dissipate a TDP (Total Dissipated Power) of 140-180 W on a microprocessor. This exchanger should be able to dissipate the reference target TDP respecting the maximum operating temperatures (above these temperatures the CPU goes into thermal throttle) and the longevity temperatures (lower than the thermal throttle temperatures). This result should be achieved while providing product versatility (based on the concept to adapt the exchanger to each socket), acceptable noise, acceptable size and cost. The heart of the project is the design of a suitable fin surface to protect processors with high TDP. In this case, a significant increase in fan speed and in the size of the finned body is inevitable. In this way, an increase in the heat removal is obtained by larger airflow rate (high number of revolutions of the fan) and the large exchange surface. Considering the impact of these changes, the design of the e...
IEEE Transactions on Components and Packaging Technologies, 2002
The presentations made, as well as the discussions, in the panels at the workshop, Thermal Challenges in Next Generation Electronic Systems (THERMES), are summarized in this paper. The panels dealt with diverse topics including thermal management roadmaps, microscale cooling systems, numerical modeling from the component to system levels, hardware for future high performance and internet computing architectures, and transport issues in the manufacturing of electronic packages. The focus of the panels was to identify barriers to further progress in each area that require the attention of the research community.
Enhanced thermal management for future processors
2003 Symposium on VLSI Circuits. Digest of Technical Papers (IEEE Cat. No.03CH37408), 2003
An enhanced thermal management mechanism that reduces power by scaling frequency and voltage in response to excessive temperatures is presented. The voltage transition process is done transparently to the execution of applications.