Development of Low Cost Sn-0.7Cu Base Composite Solder for High Temperature Application (original) (raw)
Physical properties of Sn-3.0Ag-0.5Cu lead-free solder with the additional of SiC particles
Zawawi Mahim
IOP Conference Series: Materials Science and Engineering, 2019
View PDFchevron_right
EFFECT ON MICROSTRUCTURAL AND PHYSICAL PROPERTIES OF Sn-3.0Ag-0.5Cu LEAD-FREE SOLDER WITH THE ADDITION OF SiC PARTICLES
Zawawi Mahim
European Journal of Materials Science and Engineering, 2019
View PDFchevron_right
Microstructural modifications and properties of SiC nanoparticles-reinforced Sn–3.0Ag–0.5Cu solder alloy
M. El-Shaarawy, A. A. El-Daly
Materials & Design, 2015
View PDFchevron_right
Thermal and mechanical properties of Sn-Cu-Ni-XSiC composite solder
norainiza saud
AIP Conference Proceedings, 2017
View PDFchevron_right
Influence of Silicon Nitride (Si3N4) Addition on Microstructure, Mechanical and Thermal Properties of Sn-0.7Cu Lead-Free Solder
izrul Izwan
Applied Mechanics and Materials, 2015
View PDFchevron_right
A Comparative Study of Solder Properties of Sn-0.7Cu Lead-free Solder Fabricated Via the Powder Metallurgy and Casting Methods
Prof. Dr. Mohd Mustafa Al Bakri Abdullah
REV. CHIM. (Bucharest) ♦ 64 ♦ No. 7 ♦ 2013
View PDFchevron_right
Effect of Si3N4 Addition on the Properties of Sn-1.0Ag-0.7Cu Solder Alloy
izrul Izwan
Materials Science Forum, 2015
View PDFchevron_right
Microstructure and mechanical properties of lead-free Sn-Cu-Ni composite solder paste reinforced with silicon (Si) particles
norainiza saud
AIP Conference Proceedings, 2017
View PDFchevron_right
Enhanced thermal and microstructure properties of Sn-1.0Ag-0.7Cu based lead-free solder with Titanium Oxide addition
Mohd Nazree Derman
IOP Conference Series: Materials Science and Engineering, 2019
View PDFchevron_right
The Effect of Micron-Size Silicon Additions on Microstructure, Microhardness and Thermal Properties of Sn-Cu-Ni Solder Alloy
izrul Izwan
Materials Science Forum, 2015
View PDFchevron_right
Influence of cooling conditions on microstructure and mechanical property of Sn-0.3Ag-0.7Cu lead-free solder
Tavee Madsa
2021
View PDFchevron_right
The Effect of Silicon Nitride Addition on Microstructure and Microhardness of SN100C Solder Alloy Using Powder Metallurgy
izrul Izwan
Materials Science Forum, 2014
View PDFchevron_right
Effect of Aluminium Addition on Microstructure and Microhardness of Sn-0.7Cu-xAl Lead-Free Solder Alloy
sayyidah amnah
Applied Mechanics and Materials, 2015
View PDFchevron_right
Influence of Micron-Size Activated Carbon Additions on the Microstructure, Microhardness and Thermal Properties of Sn-Cu-Ni (SN100C) Solder Fabricated via Powder Metallurgy Method
izrul Izwan
Applied Mechanics and Materials, 2015
View PDFchevron_right
Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment
Mohd Faizul Mohd Sabri
Microelectronics Reliability, 2018
View PDFchevron_right
Effect of nano-Al2O3 particles on the microstructure and mechanical performance of melt-spun process Sn–3.5Ag composite solder
Rizk M O S T A F A Shalaby
Journal of Materials Science: Materials in Electronics, 2020
View PDFchevron_right
Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles
Sunglak Choi, Thomas Bieler
Journal of Electronic Materials, 2001
View PDFchevron_right
Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles
Naďa Beronská
Journal of Electronic Materials, 2016
View PDFchevron_right
Characterization of geopolymer ceramic reinforced Sn-0.7Cu composite solder: Effect of milling time and speed
Marliza Mostapha
IOP Conference Series: Materials Science and Engineering
View PDFchevron_right
Effect of Aluminium Addition on Microstructure and Microhardness of Sn-0.7Cu-xAl Lead-free Solder Alloy
sayyidah amnah, nurul razliana
View PDFchevron_right
The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn–1Ag–0.5Cu solder alloy
Mohd Faizul Mohd Sabri
Microelectronics Reliability, 2015
View PDFchevron_right
Influence of ZnO nano-particles addition on thermal analysis, microstructure evolution and tensile behavior of Sn–5.0 wt% Sb–0.5 wt% Cu lead-free solder alloy
Eid Elsayed
View PDFchevron_right
Effect of ZnO nanoparticles addition on thermal, microstructure and tensile properties of Sn–3.5 Ag–0.5 Cu (SAC355) solder alloy
S. Fayek
Journal of Materials Science: Materials in Electronics, 2013
View PDFchevron_right
Microstructural Observation and Phase Analysis of Sn-Cu-Ni (SN100C) Lead Free Solder with Addition of Micron-Size Silicon Nitride (Si3N4) Reinforcement
izrul Izwan
Applied Mechanics and Materials, 2015
View PDFchevron_right
Development and characterization of eutectic Sn-Zn, Sn-Ag, Sn-Bi and Sn-Cu solder alloys
Shaurya tiwari
International Journal of Materials Research, 2019
View PDFchevron_right
Zn-Sn Based High Temperature Solder - A Short Review
norainiza saud
Advanced Materials Research, 2013
View PDFchevron_right
Microstructural and mechanical properties analysis of extruded Sn–0.7Cu solder alloy
Abdoul-Aziz Bogno
Journal of Materials Research and Technology, 2015
View PDFchevron_right
Composite solders
JOSE CALDERON
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1991
View PDFchevron_right
Influence of small addition of antimony (Sb) on thermal behavior, microstructural and tensile properties of Sn-9.0Zn-0.5Al Pb-free solder alloy
Eid Elsayed
View PDFchevron_right
Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing
norainiza saud
Materials, 2021
View PDFchevron_right
The Effect of Zinc Addition on the Characteristics of Sn–2.0Ag–0.7Cu Lead-Free Solders
Ramani Mayappan
2018
View PDFchevron_right