Sustainable Self-Cooling Framework for Cooling Computer Chip Hotspots Using Thermoelectric Modules (original) (raw)

The heat generation from recent advanced computer chips is increasing rapidly. This creates a challenge in cooling the chips while maintaining their temperatures below the threshold values. Another challenge is that the heat generation in the chip is not uniform where some chip components generate more heat than other components. This would create a large temperature gradient across the chip, resulting in inducing thermal stresses inside the chip that may lead to a high probability to damage the chip. The locations in the chip with heat rates that correspond to high heat fluxes are known as hotspots. This research study focuses on using thermoelectric modules (TEMs) for cooling chip hotspots of different heat fluxes. When a TEM is used for cooling a chip hotspot, it is called a thermoelectric cooler (TEC), which requires electrical power. Additionally, when a TEM is used for converting a chip’s wasted heat to electrical power, it is called a thermoelectric generator (TEG). In this s...