Heterogeneous integration of microdisk lasers on silicon strip waveguides for optical interconnects (original) (raw)
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Optics Express, 2006
A new approach for an electrically driven microlaser based on a microdisk transferred onto Silicon is proposed. The structure is based on a quaternary InGaAsP p-i-n junction including three InAsP quantum wells, on a thin membrane transferred onto silicon by molecular bonding. A p++/n++ tunnel junction is used as the p-type contact. The technological procedure is described and first experimental results show a laser emission in pulsed regime at room temperature, with a threshold current near 1.5 mA.
III-V/silicon photonics for on-chip and intra-chip optical interconnects
Laser & Photonics Reviews, 2010
In this paper III-V on silicon-on-insulator (SOI) heterogeneous integration is reviewed for the realization of near infrared light sources on a silicon waveguide platform, suitable for inter-chip and intra-chip optical interconnects. Two bonding technologies are used to realize the III-V/SOI integration: one based on molecular wafer bonding and the other based on DVS-BCB adhesive wafer bonding. The realization of micro-disk lasers, Fabry-Perot lasers, DFB lasers, DBR lasers and modelocked lasers on the III-V/SOI material platform is discussed. Artist impression of a multi-wavelength laser based on microdisk cavities realized on a III-V/SOI heterogeneous platform and a microscope image of a realized structure.
InP-on-Si Optically Pumped Microdisk Lasers via Monolithic Growth and Wafer Bonding
IEEE Journal of Selected Topics in Quantum Electronics, 2019
On-chip optical light sources are key components in photonic integrated circuits and optical communication. In this work, we use a novel integration technique called templateassisted selective epitaxy (TASE) to monolithically integrate InP microdisk lasers on silicon. TASE offers several advantages for new device concepts such as lateral doping, dense co-integration of different III-V materials, and in-plane integration with silicon electronics and passive components. Here, we demonstrate roomtemperature lasing from InP hexagonal microdisks integrated via TASE. In order to assess and evaluate the viability of TASE, a second InP hexagonal microdisk sample is prepared for comparison using the highly developed and mature direct wafer bonding technique. The lasing performance of the TASE monolithic devices and the bonded microdisk devices is investigated under pulsed optical pumping as a function of temperature and compared. The lasing threshold as well as the light-in light-out curves of our TASE structures compare favorably with the bonded InP hexagonal microdisks. This demonstrates that our TASE approach is a promising technique for the monolithic integration of optical devices on Si.
Optics express, 2007
A compact, electrically driven light source integrated on silicon is a key component for large-scale integration of electronic and photonic integrated circuits. Here we demonstrate electrically injected continuous-wave lasing in InP-based microdisk lasers coupled to a sub-micron silicon wire waveguide, fabricated through heterogeneous integration of InP on silicon-on-insulator (SOI). The InP-based microdisk has a diameter of 7.5 mum and a thickness of 1 mum. A tunnel junction was incorporated to efficiently contact the p-side of the pn-junction. The laser emits at 1.6 mum, with a threshold current as low as 0.5 mA under continuous-wave operation at room temperature, and a threshold voltage of 1.65 V. The SOI-coupled laser slope efficiency was estimated to be 30 muW/mA, with a maximum unidirectional output power of 10 muW.
Applied Physics A, 2009
Heterogeneous integration of InGaAsP microdisk lasers on a silicon platform is demonstrated experimentally using an optofluidic assembly technique. The 200-nm-thick, 5-and 10-µmdiameter microdisk lasers are fabricated on InP and then released from the substrates. They are reassembled on a silicon platform using lateral-field optoelectronic tweezers (LOET). The assembled laser with 5-µm diameter exhibits a threshold pump power of 340 µW at room temperature under pulse condition. The heterogeneously-integrated InGaAsP-on-Si microdisk laser could provide the much needed optical source for CMOS-based silicon photonics. The small footprint and low power consumption make them attractive for optical interconnect applications. The optofluidic assembly technique enables efficient use of the III-V epitaxial materials in silicon photonic integrated circuits. Appl Phys A (2009) 95: 967-972
Frontiers in Materials, 2015
Integrated optical light source on silicon is one of the key building blocks for optical interconnect technology. Great research efforts have been devoting worldwide to explore various approaches to integrate optical light source onto the silicon substrate. The achievements so far include the successful demonstration of III/V-on-Si hybrid lasers through III/V gain material to silicon wafer bonding technology. However, for potential large-scale integration, leveraging on mature silicon complementary metal oxide semiconductor (CMOS) fabrication technology and infrastructure, more effective bonding scheme with high bonding yield is in great demand considering manufacturing needs. In this paper, we propose and demonstrate a high-throughput multiple dies-to-wafer (D2W) bonding technology, which is then applied for the demonstration of hybrid silicon lasers. By temporarily bonding III/V dies to a handle silicon wafer for simultaneous batch processing, it is expected to bond unlimited III/V dies to silicon device wafer with high yield. As proof-of-concept, more than 100 III/V dies bonding to 200 mm silicon wafer is demonstrated. The high performance of the bonding interface is examined with various characterization techniques. Repeatable demonstrations of 16-III/V die bonding to pre-patterned 200 mm silicon wafers have been performed for various hybrid silicon lasers, in which device library including Fabry-Perot (FP) laser, lateralcoupled distributed-feedback laser with side wall grating, and mode-locked laser (MLL). From these results, the presented multiple D2W bonding technology can be a key enabler toward the large-scale heterogeneous integration of optoelectronic integrated circuits.
Journal of Lightwave Technology, 2000
We have performed a numerical study involving the design and optimization of InP-based microdisk lasers integrated on and coupled to a nanophotonic silicon-on-insulator (SOI) waveguide circuit, fabricated through bonding technology. The theoretical model was tested by fitting it to the lasing characteristics obtained for fabricated devices, which we presented previously. A good fit was obtained using parameter values that are consistent with numerical simulation. To obtain optimized laser performance, the composition of the InP-based epitaxial layer structure was optimized to minimize internal optical loss for a structure compatible with efficient current injection. Specific attention was paid to a tunnel-junction based approach. Bending loss was quantified to estimate the minimum microdisk diameter. The coupling between the InP microdisk and Si waveguide was calculated as function of the bonding layer thickness, waveguide offset and waveguide width. To study the lateral injection efficiency, an equivalent electrical network was solved and the voltage-current characteristic was calculated. Based on these results, the dominant device parameters were identified, including microdisk thickness and radius, coupling loss and tunnel-junction p-type doping. These parameters were optimized to obtain maximum wall-plug efficiency, for output powers in the range 1-100 W. The results of this optimization illustrate the potential for substantial improvement in laser performance.
A Compact SOI-Integrated Multiwavelength Laser Source Based on Cascaded InP Microdisks
IEEE Photonics Technology Letters, 2000
We report on the performance of a compact multiwavelength laser (MWL) source heterogeneously integrated with and coupled to a silicon-on-insulator (SOI) waveguide circuit. The MWL consists of four InP-based microdisk lasers, coupled to a common SOI wire waveguide. The microdisk lasers operate in continuous-wave regime at room temperature, with a threshold current around 0.9 mA and a waveguide-coupled slope efficiency of up to 8 W/mA, for a microdisk diameter of 7.5 m. The output spectrum contains four laser peaks uniformly distributed within the free-spectral range of a single microdisk. While thermal crosstalk is negligible, laser peak output powers vary up to 8 dB for equal microdisk drive currents, as a result of loss due to coupling with higher order modes supported by the 1-m-thick microdisks. This nonuniformity could be eliminated by reducing the microdisk thickness.