Thermal characterization of the In–Sn–Zn eutectic alloy (original) (raw)
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Study of Microstructure and Thermal Properties of the Low Melting Bi-In-Sn Eutectic Alloys
Materials Research
Beside their technological importance in soldering, the low melting eutectic alloys based on bismuth and indium have potential for commercial application in the field of phase-change materials (PCMs). In this respect, the knowledge of their microstructure and thermal properties such as melting temperature, latent heat of melting, supercooling tendency, thermal conductivity, etc. is of large importance. In this study, two ternary eutectic Bi-In-Sn alloys were investigated by means of scanning electron microscopy (SEM) with energy dispersive X-ray spectrometry (EDS) and differential scanning calorimetry (DSC). Microstructure of the prepared eutectic alloys was analyzed using SEM-EDS and identification of co-existing phases was done. Melting temperatures and latent heats of eutectic melting were measured using DSC technique. Experimentally obtained results were compared with the results of thermodynamic calculation according to CALPHAD (calculation of phase diagram) approach and good mutual agreement was obtained.
The effect of the solidification rate on the physical properties of the Sn-Zn eutectic alloy
Physica B: Condensed Matter, 2018
As-cast Sn-8.8 wt.% Zn eutectic alloy was directionally solidified with a constant temperature gradient (G=4.16 K/mm) under various solidification rates (V=8.3-790 µm/s) in a Bridgman-type furnace. The dependence of the microhardness (HV), ultimate tensile strength (σ ut), ultimate compressive strength (σ uc), and compressive yield strength (σ cy) on the solidification rate was determined. The temperature dependency of the electrical resistivity (ρ) of the sample was investigated, and the temperature coefficient of the resistivity (α) was calculated from ρ−Τ curve. The specific heat (C P) and the enthalpy (∆H) were determined by DSC analysis. The thermal conductivity was calculated using the Wiedemann-Franz equation.
Journal of Wuhan University of Technology, 2017
The development of lead-free solders has emerged as one of the key issues in the electronics packaging industries. Bi-SnAg eutectic alloy has been considered as one of the lead-free solder materials that can replace the toxic Pb-Sn eutectic solder without increasing soldering temperature. We investigated the effects of temperature gradient and growth rate on the mechanical, electrical and thermal properties of the Bi-SnAg ternary eutectic alloy. Bi-47 wt%Sn-0.68 wt%Ag alloy was directionally solidified upward with different temperature gradients (G=2.33-5.66 K/mm) at a constant growth rate (V=13.25 μm/s) and with different growth rates (V=6.55-132.83 μm/s) at a constant temperature gradient (G=2.33 K/mm) in the growth apparatus. The microstructures (λ), microhardness (HV), tensile stress (σ), electrical resistivity (ρ), and thermal properties (ΔH, C p , T m) were measured on directionally solidified samples. The dependency of the λ, HV, σ, and ρ on G and V was investigated. According to the experimental results, λ values decrease with increasing G and V, but HV, λ, and ρ values increase with increasing G and V. Variations of electrical resistivity (ρ) for cast samples with the temperature in the range of 300-400 K were also measured by using a standard dc four-point probe technique. The enthalpy of fusion (ΔH) and specific heat (C p) for the same alloy was also determined by means of differential scanning calorimeter (DSC) from heating trace during the transformation from eutectic liquid to eutectic solid.
Thermophysical Properties of the Liquid Ga–In–Sn Eutectic Alloy
Journal of Chemical & Engineering Data, 2014
Among different Ga-based alloys the properties of the Ga−In−Sn eutectic alloy make it particularly suitable for many applications, in particular as it is liquid at room temperature. However, the experimental data on its thermophysical properties are rather discrepant. In this work, the electrical and thermal conductivity, thermoelectric power, viscosity, surface tension and density of the Ga−In−Sn eutectic have been investigated in the temperature range between the melting temperature and 700 K. The experimental results obtained are compared with the data available in the literature.
Thermodynamic investigation of In-Zn-Sn ternary system
Activity of zinc in liquid In-Zn-Sn alloys has been measured by electrochemical technique based on molten salt electrolyte galvanic cell in the temperature range 753-853 K along three ternary sections of Zn x (In y Sn 1−y ) 1−x where y = 0.67, 0.50 and 0.33. The activity of indium in In-Sn binary alloys has also been measured by the same technique in the same temperature range. The activity of Zinc in In-Zn-Sn alloys shows positive deviation from the Raoult's law over entire range of composition. The activity of indium in In-Sn alloys shows negative deviations from ideality for entire composition. The excess molar free energies have been computed by the Darken's treatment of the ternary solutions using In-Sn binary data and ternary data in this study. Isoactivity curves at 813 K in the ternary In-Zn-Sn alloys were derived by combining the activity data of In-Zn and Sn-Zn alloys. The values of excess molar free energy in this study are in good agreement with those calculated from the general model calculation proposed by Chou.
Metals and Materials International, 2012
The variations of thermal conductivities of solid phases versus temperature for pure Sn and Sn-1 wt% Mg, Sn-2 wt% Mg, and Sn-6 wt% Mg binary alloys were measured with a radial heat flow apparatus. Thermal conductivity variations versus temperature for pure Sn and Sn-1 wt% Mg, Sn-2 wt% Mg, and Sn-6 wt% Mg binary alloys were found to be 60.60 ± 3.63, 61.99 ± 3.71, 68.29 ± 4.09, and 82.04 ± 4.92 W/Km, respectively. The thermal conductivity ratios of liquid phase to solid phase for pure Sn and eutectic Sn-2 wt% Mg alloy at their melting temperature were found to be 1.11 and 1.08, respectively, with a Bridgman type directional solidification apparatus. Thus the thermal conductivities of liquid phases for pure Sn and eutectic Sn-2 wt% Mg binary alloy at their melting temperature were evaluated to be 67.26 ± 4.03 and 73.75 ± 4.42 W/Km, respectively, by using the values of solid phase thermal conductivities and the thermal conductivity ratios of the liquid phase to the solid phase.
Effect of in and Zn additives on some thermal properties of a-Se
Solid State Sciences, 2010
In the present work, the effect of In and Zn on some thermo-physical properties (thermal conductivity, diffusivity and specific heat per unit volume) of amorphous Se (a-Se) have been studied. For this, simultaneous measurements of effective thermal conductivity (l e) and effective thermal diffusivity (c e) are used at room temperature for twin pellets of Se, Se 90 In 10 and Se 90 Zn 10 alloys using transient plane source (TPS) technique. It has been found that In and Zn additives changes significantly the values of thermo-physical properties (thermal conductivity, diffusivity and specific heat per unit volume) of a-Se studied in the present work. The results have been analyzed in terms of average bond strength and effective molecular weight of the binary alloys.
Thermochemistry of Pd–In, Pd–Sn and Pd–Zn alloy systems
Thermochimica Acta, 2009
The standard enthalpy of formation of several Pd-M alloys (M = In, Sn and Zn) has been measured using a high temperature direct drop calorimeter. The reliability of the calorimetric results has been determined and supported by using different analytical techniques: light optical microscopy, scanning electron microscopy equipped with electron probe microanalysis (EPMA with EDS detector) and X-ray powder diffraction analysis. The values of f H (kJ/mol atoms) for the following phases were obtained for the formation in the solid state at 300 K: PdIn (49 at.%In): −69.0 ± 1.0; Pd 2 In 3 −57.0 ± 1.0; Pd 3 In 7 : −43.0 ± 1.0; PdSn 2 : −50.0 ± 1.0; Pd 2 Zn 9 (77 at.%Zn): −33.7 ± 1.0; Pd 2 Zn 9 (78 at.%Zn): −34.0 ± 1.0; Pd 2 Zn 9 (80 at.%Zn): −35.0 ± 1.0. The results show exothermic values which increase from the Pd-Zn to the Pd-Sn and Pd-In systems; the data obtained have been discussed in comparison with those available in literature.
Soldering & Surface Mount Technology, 2019
Purpose-This study aims to investigate the chromium (Cr) effects on the microstructural, mechanical and thermal properties of melt-spun Sn-3.5Ag alloy. Design/methodology/approach-Ternary melt-spun SnAg -Cr alloys were investigated using X-ray diffractions, scanning electron microscope, dynamic resonance technique, instron machine, Vickers hardness tester and differential scanning calorimetry. Findings-The results revealed that the Ag 3 Sn intermetallic compound (IMC) and ß-Sn have been refined because of the hard inclusions' (Cr atoms) effects, causing lattice distortion increasing these alloys. The tensile results of Sn 96.4-Ag 3.5-Cr 0.1 alloy showed an improvement in Young's modulus more than 100 per cent (42.16 GPa), ultimate tensile strength (UTS) by 9.4 per cent (23.9 MPa), compared with the eutectic SnAg alloy due to the high concentration of Ag 3 Sn and their uniform distribution. Shortage in the internal friction (Q À1) of about 54 per cent (45.1) and increase in Vickers hardness of about 7.4 per cent (142.1 MPa) were also noted. Hexagonal Ag 3 Sn formation led to low toughness values compared to the eutectic SnAg alloy, which may have resulted from the mismatching among hexagonal Ag 3 Sn phase with orthorhombic Ag 3 Sn and ß-Sn phases. Mechanically, the values of Young's modulus have been increased, with increasing chromium content, whereas the UTS and toughness values have been decreased. The opposite of this trend appeared in Sn 95.8-Ag 3.5-Cr 0.7 alloy, which may have been due to high lattice distortion (ƹ = 16.5 Â 10 À4) compared to the other alloys. Increase in the melting temperature T m , DH, C p and DT was because of Ag 3 Sn IMC formation. The low toughness of Sn 96-Ag 3.5-Cr 0.5 and Sn 95.8-Ag 3.5-Cr 0.7 (109.56 J/m 3 and 35.66 J/m 3), relatively high melting temperature Tm (223.22°C and 222.65°C) and low thermal conductivity and thermal diffusivity (32.651 w.m À1 .k À1 and 0.314 m 2 /s) make them undesirable in the soldering process. The high UTS, high E, high thermal conductivity and diffusivity, low creep rate and low electrical resistivity, which have occurred with "0.1 Wt.%" of Cr, make this alloy desirable and reliable for soldering applications and electronic assembly. Originality/value-This study provides chromium effects on the structure of the eutectic SnAg rapidly solidified by melt-spinning technique. In this paper, the authors compared the elastic modulus of the melt-spun compositions, which have been resulted from the Static method with that have been resulted from the Dynamic method. This paper presents new improvements in mechanical and thermal performance.