Investigation of the LEDs heat sinks (original) (raw)
Related papers
Thermal Effect of Cylindrical Heat Sink on Heat Management in LED Applications
Energies
Light Emitting Diode (LED) applications are increasingly used in various microelectronic devices due to their efficient light generation. The miniaturisation of the LED and its integration into compact devices within the weight limit have resulted in excessive heat generation, and inefficient management of this heat could lead to the failure of the entire system. Passive and/or active heat sinks are used for dissipating heat from the system to the environment to improve performance. An ANSYS design modeller and transient thermal conditions were utilised in this study to design and simulate the LED system. The modeller performs its function by utilising the Finite Element Method (FEM) technique. The LED system considered in this work consists of a chip, thermal interface material, and a cylindrical heat sink. The thickness of the Cylindrical Heat Sink (CHS) fins used in the investigation is between 2 mm and 6 mm, whilst ensuring the mass of heat sinks is not more than 100 g. The inpu...
Electrical and Electronics Engineering: An International Journal, 2015
The article analyses the influence of the design parameters of the structure of the heat sink with round pins on the junction temperature of the LED system. The study uses design of experiment (DOE) and thermal simulations to determine the factors that have the greatest impact to improve the cooling capacity and finding the optimal heat sink design. The results of thermal design and simulation of the LED system have been validated experimentally using a thermocouple and they show that the error between the experimentally measured and simulated temperature value of optimized heat sink structure is below 6%.
Implementation of DOE in the Heat Sink Design for LED Application
2015
In this article there is analyzed the influence of various design parameters of the heat sink and their influence on the junction temperature of the LED system. Tests are performed by thermal simulations and by the use of technology for design of experiments (DOE) to find the optimal design of the heat sink. The results from the thermal modeling and simulations have been validated experimentally and they show good matching results.
Thermal Simulation and Analysis of the Single LED Module
JST: Smart Systems and Devices, 2021
Light Emitting Diodes (LED) shows an important role in replacing traditional lamps due to their longevity, high efficiency, and environment-friendly operation. However, a large portion of the electricity applied on LED converts to heat, raising up the p-n junction working temperature, and lowering the output-light quality and the LED lifetime as well. Therefore, thermal management for LED is one of the key issues in LEDs lighting application. In order to investigate the impact of each component of the LED module on the junction temperature of the LED, we have performed thermal simulations of a typical single LED module by using the finite element method. Effects of thermal conductivity and thickness of each module’s components on junction temperature were analyzed systematically. The results provided a detailed understanding of thermal behavior of a single LED module and established a crucial insight into thermal management design for high-power white LED lamp. Thermal-interface-mat...
Effect of Heat Sink Structure on Cooling Performance of LED Bulb
2014
This paper describes the effects of various parameters on the temperature of the LED device to optimize the heat sink structure of LED light bulb, and a design guideline is shown. Although the original efficiency and life of the LED device is excellent, the performance cannot be obtained due to the local temperature rise of LED element and the surrounding polymer molding material. Therefore, heat transfer analysis considering the heat convection and radiation was carried out systematically using finite element method by changing parameters of the heat sink shape. The result has shown that open type structure has advantage, and the proper design guideline for the structure of shape was obtained. Furthermore, an experimental model was prototyped, then the temperature distribution was measured, consequently it has been verified that the analysis results were well consistent with the empirical data.
2008
Light Emitting Diodes (LEDs) have been around for years, primarily concentrated as the lighting source for a variety of applications. Besides their electrical properties the optical parameters of LEDs also depend on junction temperature. The junction temperature of the power LEDs affects the device’s luminous flux, the color of the device, and its forward voltage. The key in that case is maintaining the specified junction temperature. For this reason thermal characterization and thermal management play important role in case of power LEDs, necessitating both physical measurements and simulation tools.
IJERT-Design and Analysis of a Heat Sink for a High Power LED System
International Journal of Engineering Research and Technology (IJERT), 2015
https://www.ijert.org/design-and-analysis-of-a-heat-sink-for-a-high-power-led-system https://www.ijert.org/research/design-and-analysis-of-a-heat-sink-for-a-high-power-led-system-IJERTV4IS070752.pdf Recently, the high-brightness LEDs have begun to be designed for illumination application. The enhanced electrical currents accustomed drive LEDs result in thermal problems. Thermal management for crystal rectifier module could be a key style parameter as high operation temperature directly affects their most lightweight output, quality, dependability and life time. during this study a conductor is intended to dissipate heat created by the contact of a high power crystal rectifier lightweight. the look involves a series of crystal rectifier lights in a very industrial setting that required to be cooled. the warmth sinks area unit designed to use water (60psi) because the fluid to cool down the LED's properly. every conductor could be a compact device with semi-circular fins to function buffer plates to reinforce heat transfer. The mass flow rates of the fluid varied because the parameter for explicit fin styles. 3 mass flow rates and 4 fin geometries were investigated parametrically. the ultimate results of the study proposes Associate in Nursing optimum style with minimum pressure drop across every conductor whereas maintain the crystal rectifier junction temperature underneath check.
Thermal Management of Power LED System
LEDs are used in many areas today. Street lighting is one of them and high-power LEDs are utilized in this area. Electrical energy is converted into light with an efficiency in 10-25% range. The rest is converted into heat. The generated heat is largely caused from LED chip. Furthermore, Driver circuit would also causes heat rise. Removing of this heat from the system is important in order to LED system efficiency because increasing of temperature causes a reduction of luminous flux. Excellent thermal management plays a significant role in terms of efficiency, reliability and durability. In this study, losses are caused from the LED chip and the heat sink which are part of the LED lighting systems are examined. These elements are thermally analyzed. The impacts of these losses on efficiency will be presented.
Experimental Analysis Of Radial Heat Sink For High Power LED Application
It was found that light emitting diodes (LED) Janus-faced a vital downside of warmth dissipation as a result of most of input energy equipped to light-emitting diode is reborn into heat. If LED chips become hot, it will create PN junction temperature too high, which results in reduced life time and unstable lightweight emission. Many researchers attempt to solve this downside of warmth dissipation by victimisation conductor of assorted geometries. In present study cooling system is projected that primarily consist of radial conductor. The general air flow pattern is comparable to it of a chimney, it means once cool air enters from outside is heated as it passes between the fins so rises from the inner region of the warmth sink. Natural convection heat transfer at the heat sink base is validated by experimentation. In the present study cooling performance of 3 conductor profiles (LM sort pin-fin conductor, heat sink with staggered form of pin-fins, heat sink with tallest fins on outside) were analyzed by experimentation and a reference profile is set..
Theoretical analysis of thermal conditions and ways of led temperature stabilization
2016
Thermoelectric model of a light diode was built with a spacial separation of the heat and cold source. The differential equations system was solved, which comprises the stationary equation of the heatconductivity and the equation of Joule thermogeneration. The temperature distribution in the structural elements of LED was calculated and also the temperature of active zone overheating in dependence on the power of LED and the intensity of the heat exchange with the medium. For the numeral estimation a powerful white light diode was chosen-Gree XR7090WHT. It was found out that the light stream can be increased via current increasing, at simultaneous thermal stabilizing of its active zone.