The contact angle of thin-uncured epoxy films: thickness effect (original) (raw)
2004, Colloids and Surfaces A-physicochemical and Engineering Aspects
The contact angle of thin-uncured epoxy films spin casted on oxidized silica wafers has been investigated as a function of their thickness in the range of 5-75 nm. Based on the contact angle measurements with polar and apolar liquids, the surface free energy of various films were analyzed and compared using Lifshitz van der Walls/acid-base and harmonic mean (Wu's) approaches. The results show that the nature of the surface of epoxy films change to more hydrophobic state as its thickness increases. Furthermore, time monitoring of the contact angle of the surface of epoxy films reveals a more rapid conformational change or flip-flop of surface epoxy chains for thicker layers.
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