Spray Cooling Thermal Management of a Semiconductor Chip Undergoing Probing, Diagnostics, and Failure Analysis (original) (raw)

2003

Abstract

With the proliferation of flip chip packaging and multiple metal layer technology in advanced semiconductor integrated circuits (IC’s), traditional front-side probing and failure analysis tools are no longer viable. Full transistor level access from the substrate side (i.e., backside) of the chip is now required to fully realize such investigative work. Silicon is transmissive in the near-IR above its bandgap (≅ 1,000nm to 1,100nm). As a result, transistor level access can be achieved by optical means. To enable such optical access, it is necessary to first remove all heat dissipating devices such as finned heat sinks and integrated heat spreaders placed in contact with the silicon substrate. For most applications, the silicon is then mechanically thinned down to approximately 100μm, and a microscope objective is used to “probe” the chip optically for diagnostics and failure analysis. During such diagnostics and failure analysis, the device under test (DUT) is electrically exercised...

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