Review on Thermoelectric materials and applications (original) (raw)
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A Review on Thermoelectric Cooler
Energy disaster and environment pollution are the two major problems of 21 century. Thermoelectric devices are one of key solutions to these problems. These devices attract the researchers because of its solid state nature that converting the heat given off from vehicles, electrical instruments, etc. into the electricity. This paper contains the previous research on thermoelectric cooler and recent advance on it.
Improvement In The COP Of Thermoelectric Cooler
International Journal of Scientific & Technology Research, 2016
This paper described the study for heat transfer through thermoelectric cooler (TEC) by use of multistage thermoelectric module. To satisfy the heat dissipation of modern electronic element, thermal designers have to increase fin area and fan speed to improve its cooling capacity. However, the increase of fin area is restricted by the space. Besides, the increase of fan speed would induce noise, which damages human health. So air cooling by fan is hardly to meet the requirement of modern electronic component. Recently, thermoelectric cooler (TEC) is applied to electronic cooling with the advantages of small size, quietness and reliability. A typical thermoelectric cooler consists of p-type and n-type semiconductor pellets connected electrically in series and sandwiched between two ceramic substrates. Whenever direct current passes through the circuit, it causes temperature differential between TEC sides. As a result, one face of TEC, which is called cold side, will be cooled while i...
New physical interpretation of thermoelectric cooling in semiconductor structures
Brazilian Journal of Physics, 2006
Nontraditional approach to explain the thermoelectric cooling is suggested . It is based on the Le Chatelier-Braun thermodynamic principle. New effect of cooling and heating of junction of two materials (barrierless thermoelectric cooling) is theoretically predicted, and this effect is different from the Peltier effect (barrier thermoelectric cooling). The suggested thermoelectric effect must be displayed always at the finite values of the junction surface heat conductivity η. Barrierless thermoelectric effect occurs even in the case when the conducting materials are identical with the same Peltier coefficients. It is shown that both barrier and barrierless thermoelectric cooling effects always exist simultaneously in the general case. The reasons proving reversibility of the thermoelectric cooling process are resulted.
Design and characterization of cold point thermoelectric coolers
Twenty-First International Conference on Thermoelectrics, 2002. Proceedings ICT '02.
We describe structured point-contact thermoelectric devices that confine the thermal gradients and electric fields at the boundaries of the cold end, and exploits the reduction of thermal conductivity at the interfaces, tunneling properties of point contacts, and the poor electron-phonon coupling at the junctions. We propose a theory of the structured cold point metal-semiconductor contacts and detail the design of cold point thermoelectric coolers. Temperature and electrical measurements of prototype cold point coolers using bismuth chalcogenides in vacuum indicate doubling of the thermoelectric figure-of-merit ZTvalues to the range of 1.4-1.7 at room temperature.
2005
The project is basically to build an appropriate circuit for solid state thermoelectric cooler or heater. The circuitry is used to control the connection in cold mode and hot mode. The peltier device is fabricated by combining the standard n-and p-channel semiconductor material with a two-element field emission device inserted into each of the two channels to eliminate the solid-state thermal conductivity. In general, two important components building up the thermoelectric cooler or heater is the temperature controller using a microcontroller and peltier device that consists ofanntype and p-type semiconductors of bismuth-telluride (Bi Tei) connected by H-bridge circuitry. Both elements must be connected in such a way as to produce a heat sink and heat source that are portable and using small amount of power in the atmosphere of a car. For the microcontroller to work, a specific program is loaded and programmed inside the memory of the PIC 16F877. The objectives of this project are to have theoretical review on thermoelectric devices, search and learn the method of developing the device. The activities are mainly focused on design and simulation. All findings and the detailed analysis including key elements of the project, which is to decide the parameters, and the design procedure that should be used, will be conducted as to follow the overall concept of the project. in ACKNOWLEDGEMENTS Firstly, I would like tothank to Allah SWT for giving me the opportunity to finish my final year project successfiilly. I would like to give my honest appreciation to Universiti Teknologi Petronas for giving me an opportunity inorder to finish my final year project on Solid-State Based Thermoelectric Device for Cooling and Heating project. It has been an honour and privilege formeto be involved in this final yearproject. The special thank goes to my dear supervisor, Dr John Ojur Denis who have been so supportive. The supervision and cooperation that he gave truly help me to finish the project are muchappreciated. My gratitude goes to my parents, Hj Mohd Said Ishak and Hjh Khairiah Arshad for giving me fiill support and encouragement all the way until the finishing of my final year. My gratefulthanks to Miss Siti Hawa, Mr Yassin and all the Electricaland Electronic technician. The contribution and hard work from all during my final year project is very great indeed. Not to forget the coordinators of Final Year Project for electrical and Electronic Department. All the patient in helpingus completethis project is much appreciated. IV
A Design of Thermoelectric Cooler and Optimization
Design, analysis and optimization of a thermoelectric refrigerator was carried out in this work the systems use thermoelectric "peltier" refrigerators (thermoelectric modules) to produce cooling or heating. The design calculation are find the performance curve of the thermoelectric module with the purpose of is find by simulation. Simulation results were compared with the practical data. The system simulation shows that exist a cheapest heat sink used for the thermoelectric refrigerator. the thermoelectric refrigerator with an air-cooled heat sink with thermal resistance 0.2515°C/W. Comparison was done between Bismuth telluride (Bi2Te3) and Antimony telluride(Sb2Te3) for the thermoelectric module. It was found that the bismuth telluride (Bi2Te3) due to its low thermal conductivity and high See back coefficient at room temperature has higher figure of merit (Z) and thus performed better as compared to Antimony telluride. The design be capable of be ready either on basis of the highest value of the cooling capacity, or on the basis of the most excellent heat sink technology existing.
Review on Design and Theoretical Model of Thermoelectric
IJSRD, 2013
This paper presents the theoretical development of the equations that allow to evaluate the performance of an air conditioning system based on the thermoelectric effect. The cooling system is based on a phenomena discovered by Jean Charles Athanase Peltier, in 1834. According to this when electricity runs through a junction between two semiconductors with different properties, heat is dissipated or absorbed. Thus, thermoelectric modules are made by semiconductors materials sealed between two plates through which a continuous current flows and keeps one plate hot and the other cold. The most important parameters to evaluate the performance of the device thermoelectric refrigeration are the coefficient of performance, the heat pumping rate and the maximum temperature difference between the hot side and the cold side of the thermoelectric module.
Compact design of thermoelectric cooler and its performance analysis
1ST INTERNATIONAL CONFERENCE ON MANUFACTURING, MATERIAL SCIENCE AND ENGINEERING (ICMMSE-2019), 2019
Thermoelectric cooling is one of the easiest and cheapest ways of recovering waste heat and convert it to obtain required cooling effect. A 127 couple thermoelectric cooler (TEC) is taken and its performance is analyzed. Also focus has been made to get an optimal and compact design with a better cooling capacity. Simulation is carried out in COMSOL Multiphysics 5.0 by varying parameters such as size and cross section of thermoelectric leg, number of couples in the module, thickness of copper conductor and the most important parameter the semiconductor material. Choosing Bismuth Telluride as semiconducting material, the cooling capacity is found to be 21.04 W when the TEC legs are made in circular cross section with 0.2 cm leg length and 41.87 W when leg length is 0.1 cm with copper plate thickness of 0.05cm which is almost double. With Bismuth antimony as a semiconductor material cooling effect is measured to be 538.38W for the same configuration which makes any designer to incline towards choosing this material. Non-linear circular cross section leg TEC, Bismuth Antimony as semiconducting material is giving a better cooling capacity than a non-linear square cross section leg TEC, Bismuth Telluride as material. For a given cooling capacity the size of TEC can be minimized since the results of 126 couple TEC is showing just 0.1 % lesser value as that of 127 couple TEC.