Microwave and Millimeter-Wave Integrated Circuit Systems in Packaging (original) (raw)
2009
In this work, EM simulation tools were exploited to investigate the package and interconnect structures for millimeter-wave and high-speed communication systems. Precise prediction on properties of passive structures as well as active devices is achieved by using accurate EM simulation techniques developed in this work. Complex 3D EM designs and modelling can be successfully accomplished by using EM simulations. As the foundation of the work, the general recommendations for EM simulations are firstly summarized according to two practical examples: design of a split ring resonator and investigation on multimode propagation in CPW structures. For the case of EM modelling of on-wafer measured passive components for millimeter-wave applications, a novel ground-ring excitation scheme with simple ground-signal-ground (G-S-G) probe models is proposed. The parasitic elements caused by the excitation structure are de-embedded by an extended "L-2L" calibration method. The excitation...
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