Sensitivity Analysis of MEMS Capacitive Pressure Sensor with Different Diaphragm Geometries for High Pressure Applications (original) (raw)
Related papers
International Journal of Engineering Research and Technology (IJERT), 2015
https://www.ijert.org/sensitivity-analysis-of-mems-capacitive-pressure-sensor-with-different-diaphragm-geometries-for-high-pressure-applications https://www.ijert.org/research/sensitivity-analysis-of-mems-capacitive-pressure-sensor-with-different-diaphragm-geometries-for-high-pressure-applications-IJERTV4IS030671.pdf In this paper three MEMS capacitive pressure sensors with different diaphragm geometries are designed and simulated. The sensors modelled have square, circular and rectangular diaphragms, with some fixed area. The diaphragm thickness of the three sensors is 63μm. The sensors are designed for high pressure sensing, over a range of pressure varying from 1Mpa to 100Mpa. The paper presents a rectangular diaphragm designed using a golden ratio of rectangle design widely used in image processing application with the ratio (b/a) equal to 1.618. Silicon<100> is used as a diaphragm material, because of its excellent properties. The paper provides a thorough analysis and discussion on different performance parameters for capacitive pressure sensing, such as the total displacement, capacitance, PRCC (Percentage Relative Change in Capacitance), electrical sensitivity. The design and simulation of the pressure sensors have been done based on Finite Element Method using Multiphysics simulation platform. Such kind of pressure sensors can be used in harsh environments involving high pressure applications.
In this paper the effect of the geometry of the silicon diaphragm used as moving plates in a Micro-electromechanical systems pressure sensor operating in harsh environments is studied. The principle of the paper is to propose a most ideally suitable geometry of the moving plate and bottom plate of parallel plate MEMS parallel plate capacitor which will have a better sensitivity when compared to the other geometric shapes of the moving plate diaphragm having the same area of cross section and thickness. The theoretical mathematical results are compared with the simulation using MEMS SOLVER software where the deflection dependency on the shape and size of the diaphragm is clearly visualized. As the sensitivity of the pressure sensor is dependent on the deflection of the moving diaphragm through the gap between the plates and the amount of deflection depends on the shape and size of the diaphragm the geometry of the diaphragm plays important role in the design of the sensor. The proposed pressure sensor parameters are radius of the diaphragm150µm 2 , and the thickness is 6µm and the gap between the plates is 10µm. The range of the sensor is 0-1MPa. Keywords-MEMS, capacitive pressure sensor, harsh environment, MEMS Solver, and diaphragm geometry.
2021
Capacitive pressure sensors have become more popular as compared to piezoresistive pressure sensors as they yield superior sensitivity and lesser non-linearity. Efficient analysis for modelling capacitive pressure sensors is thus increasingly becoming more important due to their innumerable use cases. The higher sensitivity of square diaphragm for the same side length in comparison to circular diaphragm makes it ideal for sensor design. In this work, a complete formulation for analysis of capacitive pressure sensor with the square diaphragm in normal and touch mode operation has been presented as these two modes are established operating modes for these sensors. A comprehensive study of sensor parameters like capacitance, diaphragm deflection, capacitive and mechanical sensitivity has been formulated to aid the choice of sensor characteristics. This work also focuses on the method to determine core design parameters for optimal operation. Computationally complex methods have been us...
Design and Simulation of MEMS Capacitive Pressure Sensor
Employing the MEMS technology, high sensitivities and resolutions have been achieved. Capacitive sensing uses the diaphragm deformation-induced capacitance change. In this paper, the design and simulation of conventional slotted and touch mode MEMS capacitive pressure sensor is proposed. The designed sensors are composed of a polysilicon diaphragm that deflects due to pressure applied over it, is accounted for modeling. The simulation results shows that the slotted MEMS capacitive pressure sensor achieves good sensitivity where as the touch mode MEMS capacitive pressure sensor achieves good linearity and large operating pressure range. The proposed MEMS capacitive pressure sensor demonstrated with diaphragm of side length 20 μm, gap depth 2 m is being modelled. The sensor exhibit a linear response for the pressure applied between 0 to 50 MPa. The simulation is carried out for different types of MEMS capacitive pressure sensor using COMSOL Multiphysics.
Energy Harvesting and Systems, 2021
In this paper, the improvement of the sensitivity of a capacitive MEMS pressure sensor is investigated. The proposed spring for the sensor can increase the sensitivity. Silicon is used as the substrate and gold and aluminium nitrate are used as the diaphragm and the dielectric layer, respectively. The dimensions of the diaphragm are 150 µm × 150 µm, which is suspended by four springs. The air gap between the diaphragm and the top electrode is 1.5 µm. The proposed structure is an efficient sensor for the pressures in the range of 1–20 kPa. By using the proposed design, the sensitivity of the MEMS sensor in 18 kPa has improved to 663 (× 10−3 pF/kPa).
In this paper, An analytical and simulation solution for touch mode Micro-electromechanical systems (MEMS) capacitive pressure sensor operating in harsh environment is proposed, The principle of the paper is to design, obtain analytical solution and compare the results with the simulation using coventor software for a circular diaphragm deflection before and after touch point. The material is considered to be used for harsh environment is SiC (Silicon Carbide), Because of SiC owing excellent electrical stability, mechanical robustness, and chemical inertness properties and the application of pressure sensors in harsh environments are, such as automotive industries, aerospace, oil/logging equipments, nuclear station, and power station. We are using coventor software for modeling and simulating of MEMS capacitive pressure sensor to optimize the design, improve the performance and reduce the time of fabricating process of the device. The device achieved a linear characteristic response and consists of a circular clamped-edges poly-SiC diaphragm suspended over sealed cavity on a poly-Sic substrate. The proposed touch mode MEMS capacitive pressure sensor demonstrated diaphragm ranging from 150ìm to 360ìm in diameter, with the gap depth from 0.5ìm to 6ìm and the sensor exhibit a linear response with pressure from 0.05 Mpa to 10 Mpa.
IJERT-Comparative Analysis on Design and Simulation of Perforated Mems Capacitive Pressure Sensor
International Journal of Engineering Research and Technology (IJERT), 2015
https://www.ijert.org/comparative-analysis-on-design-and-simulation-of-perforated-mems-capacitive-pressure-sensor https://www.ijert.org/research/comparative-analysis-on-design-and-simulation-of-perforated-mems-capacitive-pressure-sensor-IJERTV4IS070322.pdf MEMS sensor has gained popularity in automotive, biomedical, and industrial applications. In this paper, the design and simulation of conventional, slotted and perforated MEMS capacitive pressure sensor is proposed. Polysilicon material is used as diaphragm material that deflects due to applied pressure. Better sensitivity is the main advantage of conventional pressure sensor as compared with other two sensors and perforated pressure sensor achieves large operating pressure range. The proposed MEMS sensor demonstrated with diaphragm length 50um, gap depth 3um is being modelled. The simulation is carried out for different types of MEMS capacitive pressure sensor using COMSOL Multiphysics and Coventor ware.
International Journal of Computer Applications
In this paper two MEMS capacitive pressure sensor of two diffident geometries are designed for measurement of absolute pressure. Both of these sensors are designed as parallel plates where one is movable and the other is fixed. The only difference with common parallel plate structure is that one of the movable plates is supported by four anchors with respect to the fixed plate. Here we have considered two such structures, one having square shaped parallel plates whereas the other having circular shaped. The area of the diaphragms for both the sensors are equal and will perform to sense absolute pressure variations for a very specific range. This specified range of absolute pressure is 10 KPa to 100 KPa for 5 micron thick diaphragm with 3600 micrometer area. Here silicon and silicon compound (like PolySi and SiC) are chosen for diaphragm material. In this paper various factors which play a critical role for measuring absolute pressure in the performance of a MEMS capacitive pressure ...
Comparative Analysis on Design and Simulation of Perforated Mems Capacitive Pressure Sensor
International Journal of Engineering Research and, 2015
MEMS sensor has gained popularity in automotive, biomedical, and industrial applications. In this paper, the design and simulation of conventional, slotted and perforated MEMS capacitive pressure sensor is proposed. Polysilicon material is used as diaphragm material that deflects due to applied pressure. Better sensitivity is the main advantage of conventional pressure sensor as compared with other two sensors and perforated pressure sensor achieves large operating pressure range. The proposed MEMS sensor demonstrated with diaphragm length 50um, gap depth 3um is being modelled. The simulation is carried out for different types of MEMS capacitive pressure sensor using COMSOL Multiphysics and Coventor ware.
MEMS Capacitive Pressure Sensors: A Review on Recent Development and Prospective
—Recently MEMS Capacitive Pressure Sensor gains more advantage over micromachined piezoresistive pressure sensor due to high sensitivity, low power consumption, free from temperature effects, IC compatibility, etc,. The spectrum of capacitive pressure sensor application is increasing, hence it is essential to review the path of technological development and further prospective of micromachined capacitive pressure sensor. This paper focuses on the review of various types of capacitive pressure sensor principle, MEMS materials used in fabrication, procedures adopted in microfabrication for silicon and polymer material diaphragm, bonding and packaging techniques used. Selected result on capacitive sensitivity, effect of temperature on capacitive sensitivity was also presented. Finally, the development of smart sensor was discussed. MEMS Capacitive pressure sensor, Review on pressure sensor, CDPS, MEMS Fabrication, MEMS Material, pressure sensor, MEMS (Micro Electro Mechanical System)