Capacitance extraction from complex 3D interconnect structures (original) (raw)

A new tool has been developed for calculating the capacitance matrix for complex 3D interconnect structures involving multiple layers of irregularly shaped interconnect, imbedded in different dielectric materials. This method utilizes a new 3D adaptive unstructured grid capability, and a linear finite element algorithm. The capacitance is determined from the minimum in the total system energy as the nodes are varied to minimize the error in the electric field in the dielectric(s). DISCLAIMER This repoil was prepared as an account of work sponsored by an agency of the United States Government. Neither the United States Government nor any agency thereof, nor any of their employees, make any warranty, express or implied, or assumes any legal liability or respom*bility for the accuracy, completeness, or usefulness of any information, apparatus, product, or process disdased, or represents that its use would not infringe privately owned rights. Reference herein to any specific commerdal product, process, or sem'ce by trade name, trademark, manufacturer, 01: otherwise does not necessarily corntitUte or imply its endorsement, recommendation, or favoring by the United States Government or any agency thereof. The views and opinions of authors expressed herein do not necessarily state or reflect those of the united States Government or any agency thereof.