Automated UV-Epoxy-Based Micro-Optic Assembly for Kilowatt-Class Laser-Diode Arrays and Modules (original) (raw)
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Automated UV-Epoxy Based Micro-Optic Assembly for kW-Class Laser-Diode Arrays and Modules
IEEE Transactions on Components, Packaging and Manufacturing Technology
This paper outlines the numerous interdisciplinary activities required to implement two ultraviolet (UV) epoxy based automated micro-optic assembly tools within a "smart factory" for high-power semiconductor laser manufacturing. After a brief overview of the motivation and approach, two examples of automated micro-optic assembly tools (e.g. fast-axis collimation (FAC) lens attach and mirror stripe alignment) for kW-class laser diode arrays and modules are given that demonstrate the breadth of automation activities required within a modern factory. For each system, the complete assembly sequence is outlined and the steps which presented fully automated challenges are highlighted. In contrast, to previous published results which focused on the details of the automated micro-optic alignment, the largest challenges primarily involved automation and repeatability of the UV-epoxy dispense and attach processes for these high-power semiconductor devices. These were solved by precise and stable mechanical design, customized lighting, and machine vision solutions. Finally, the complete integration of the tools into a "smart factory" system is outlined.
Automated robotic microassembly of flexible optical components
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This paper studies the fabrication of hybrid microcomponents through automated robotic microassembly. The robotic station used for the microassembly is presented in this paper and its use for the assembly of flexible optical microcomponents is done as a case study. Fully automated microassembly is done for better repeatability and accuracy of the tasks and to reduce the time cycle. For this reason, two complementary techniques are proposed and presented in this paper. The first technique consists of automated manipulation and insertion tasks using stereovision CAD-model based visual tracking. The second technique has been performed using hybrid force/position control and enable to perform grasping, guiding and releasing tasks in less than 1 s despite microscale specificities. These specificities are mainly manifested by the predominance of surface forces, the difficulty of integration sensors at this scale, the very small inertia of microcomponents and their high dynamics and the lack of precise models.
Applied Physics Letters, 1995
Novel self-aligned hybrid integration of semiconductor lasers with three-dimensional micro-optical components has been demonstrated. The self-alignment structures are fabricated integrally with other three-dimensional micro-optical elements such as micro-Fresnel lenses, mirrors, and gratings on a single Si chip by surface micromachining technology. The Si substrate serves as a free-space micro-optical bench for active and passive optoelectronic components. A divergent beam emitted from an edge-emitting semiconductor laser has been successfully collimated by the integrated micro-Fresnel lens. The integration scheme offers a new approach for optoelectronic packaging and a new technology platform for integrating complete free-space micro-optical system on a single chip.
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We describe an original integration technological platform for the miniaturization of micromachined on-chip optical microscopes, such as the laser scanning confocal microscope. The platform employs the multi-wafer vertical integration approach, combined with integrated glass-based micro-optics as well as micro-electro-mechanical systems (MEMS) components, where the assembly uses the heterogeneous bonding and interconnecting technologies. Various heterogeneous components are disposed in vertically stacked building blocks (glass microlens, MEMS actuator, beamsplitter, etc.) in a minimum space. The platform offers the integrity and potential of MEMS microactuators integrated with micro-optics, providing miniaturized and low cost solutions to create micromachined on-chip optical microscopes.
Reconfigurable micro-assembly system for photonics applications
Proceedings 2002 IEEE International Conference on Robotics and Automation (Cat. No.02CH37292)
The assembly of parts with dimensions several hundred microns or less is a challenging problem, and has received increasing attention for applications in areas such as telecommunication, automotive, and biotechnology. Current state of the art micro-assembly systems are often specialized devices and software. In this paper we present a reconfigurable assembly system designed to handle micro-parts in such a way that high precision actuation and sensing is used only in the subsystems where it is actually necessary. Aspects related to part gripping, fixturing, sensing, motion and bonding are discussed. Analysis and experiments are presented to show that this architecture can lead to a relatively low cost and flexible assembly solution.
Journal of Micromechanics and Microengineering, 2010
The 3D integration of hybrid chips is a viable approach for the micro-optical technologies to reduce the costs of assembly and packaging. In this paper a technology platform for the hybrid integration of MOEMS components on a reconfigurable free-space silicon micro-optical bench is presented. In this approach a desired optical component (e.g. micromirror, microlens) is integrated with removable and adjustable silicon holder which can be manipulated, aligned and fixed in the precisely etched rail of the silicon baseplate by use of robotic micro-assembly station. An active-based gripping system allows modification of the holder position on the baseplate with nanometre precision.
Optoelectronic Microsystems Integration
Optics and Photonics News, 2003
O ptical interconnections in electronic systems are being implemented at shorter and shorter distances as data rates rise and system size and power dissipation shrink. Very-short-reach optical interconnections, which operate at ranges of tens to hundreds of meters, are commercially available and will likely maintain market share in situations in which electrical alternatives are more expensive to implement. For the next generation of systems, optical technology stands at a threshold: industry roadmaps predict the integration of optical interconnections and optical functions into board-, package-and chip-level electrical systems. The preponderance of electrical microsystem analyses include projections that optics will play a role in electrical systems,
Model-Based Optoelectronic Packaging Automation
IEEE Journal of Selected Topics in Quantum Electronics, 2004
In this paper, we present an automation technique that yields high-performance, low-cost optoelectronic alignment and packaging through the use of intelligent control theory and system-level modeling. The control loop design is based on model-based control, previously popularized in process and other control industries. The approach is to build an a priori knowledge model, specific to the assembled package's optical power propagation characteristics, and use this to set the initial "feed-forward" conditions of the automation system. In addition to this feed-forward model, the controller is designed with feedback components, along with the inclusion of a built in optical power sensor. The optical modeling is performed with the rigorous scalar Rayleigh-Sommerfeld formulation, efficiently solved online using an angular spectrum technique. One of the benefits of using a knowledge-based control technique is that the efficiency of the automation process can be increased, as the number of alignment steps can be greatly reduced. An additional benefit of this technique is that it can reduce the possibility that attachment between optical components will occur at local power maximums, instead of the global maximum of the power distribution. Therefore, the technique improves system performance, while reducing the overall cost of the automation process.
Micromachined integrated optics for free-space interconnections
Proceedings IEEE Micro Electro Mechanical Systems. 1995, 1995
A novel surface micro-machined micro-optical bench (MOB) has been demonstrated. Free-space micro-optics such as micro-Fresnel lenses, rotatable mirrors, beam-splitters and gratings are implemented on a single Si chip using IC-like microfabrication processes. Self-aligned hybrid integration with semiconductor lasers are also demonstrated for the first time. The MOB technology realizes a microoptical system on a single Si chip and has significant impact on free-space integrated optics, optical switching, optical data storage, and optoelectronic packaging.