Dielectric Material Options for Integrated Capacitors (original) (raw)
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Toward an Improved Understanding of the Role of Dielectrics in Capacitors
Materials, 2018
A new fundamental principle of the theory of dielectrics in capacitors is demonstrated. That is, dielectric material in any geometry that reduces the field generated by charges on capacitor electrodes is effective in increasing capacitance. Specifically, it is shown that super dielectric material on the outer surfaces of the electrodes of a parallel plate capacitor increases dielectric constant, as well as energy and power densities, by orders of magnitude. The implicit assumption in all current capacitor theory, that the “capacitor” is only that region occupied by the electrodes and the space between them, is shown to be incorrect.
Homogeneous/Inhomogeneous-Structured Dielectrics and their Energy-Storage Performances
Advanced materials (Deerfield Beach, Fla.), 2017
The demand for dielectric capacitors with higher energy-storage capability is increasing for power electronic devices due to the rapid development of electronic industry. Existing dielectrics for high-energy-storage capacitors and potential new capacitor technologies are reviewed toward realizing these goals. Various dielectric materials with desirable permittivity and dielectric breakdown strength potentially meeting the device requirements are discussed. However, some significant limitations for current dielectrics can be ascribed to their low permittivity, low breakdown strength, and high hysteresis loss, which will decrease their energy density and efficiency. Thus, the implementation of dielectric materials for high-energy-density applications requires the comprehensive understanding of both the materials design and processing. The optimization of high-energy-storage dielectrics will have far-reaching impacts on the sustainable energy and will be an important research topic in ...
Electrical properties of dielectric foil for embedded PCB capacitors
Materials Science-Poland, 2012
One of the methods of achieving high packaging density of passive elements on the PCB is using the capacitors embedded in multilayer PCB. Test structures consisting of embedded capacitors were fabricated using the FaradFlex® capacitive internal layers. Impedance spectroscopy and equivalent circuit modelling was used to determine their electrical properties such as the capacitance, parasitic resistance and inductance. The use of several stages of accelerated ageing allowed us to test the durability of the structures. The results showed good quality stability of the embedded elements. The spatial distribution of the capacitance of the test structures on the surface of the PCB form was tested. The influence of the process parameters during lamination on the values of embedded capacitors was revealed.
Dielectric Films for Advanced Microelectronics
2007
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Environmental conditions influence on embedded capacitors - Comparison with discrete capacitors
2010
The technology evolution of capacitors from a precedent paper in 1993 in which we studied a ceramic capacitor reported on a FR4 substrate to today's is very important. In order to reduce the risk of early failures peculiar to ceramic capacitors, technologists are using new polymer-ceramic materials embedded in the FR4 or FLEX substrate during the manufacturing step. In this paper the robustness of such embedded capacitors regarding the environmental conditions (temperature and humidity) was studied and compared to discrete ceramic capacitors.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012
Highly accelerated life testing (HALT) was performed on embedded planar capacitors by subjecting these devices to elevated temperature and voltage aging conditions. The dielectric material of these capacitors was a nanocomposite of epoxy and BaTiO 3. The objective of HALT was to model the time-to-failure as a function of temperature and voltage using the Prokopowicz model. This involved computing the constants of the Prokopowicz model, voltage exponent (n), and activation energy (E a) for a nanocomposite of epoxy and BaTiO 3. The results of HALT can be used for the qualification of embedded planar capacitors and for further improvement in the material and the manufacturing processes of these capacitors.