Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging (original) (raw)

Drive towards lead-free electronics began in the early 2000s. Solder pastes based on tin (Sn), copper (Cu), and silver (Ag) were the initial replacement for the traditional SnPb solder. With the SAC alloys, several researches reported that one year of aging consumed more than 50% of the component life. Once the detrimental effects of aging were discovered, the industry started the search for better solder paste materials. The SAC based pastes were made better by adding elements such as Bismuth (Bi), Antimony (Sb), Nickel (Ni). Recently, all the leading manufacturers have introduced new solder materials that claim to have high reliability in harsh environments. Extensive tests are required to filter the best solder pastes. In the study, three high reliability solder materials from leading manufacturers have been selected and used for the test vehicle assembly. SAC305 paste is also included for comparison with the new materials. The test vehicle is a printed circuit board (PCB) of FR-...

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