Packaged X-band T/R module for active phased array radar applications (original) (raw)

1994

Abstract

In this article we describe a global design approach of an X-band Tx/Rx module which, by means of a Multi Chip Module (MCM) technique, includes in a single package the different microwave functions (4-bit phase-shifter, low-noise amplifier, power amplifier, switching control circuits), the thin film interconnections, the bias circuits, the driver circuits (Si ICs) and the switching MOS.

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