High-frequency full-wave analysis of interconnects with inhomogeneous dielectrics through an enhance (original) (raw)
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Recent Developments of Transmission Line Models for Full-Wave Analysis of Interconnects
ursi.org
The paper presents a complete review of a recently proposed enhanced transmission line (TL) model, which extends the validity of the popular TL model to frequency ranges where the transverse characteristic dimension of the interconnect is no longer electrically short. While retaining the same mathematical simplicity of a TL model, the model presented here is derived from a full-wave integral formulation, in terms of electromagnetic potentials. Casestudies and benchmarks show its ability to foresee high-frequency effects like radiation or dispersion. Furthermore, two-port representations of the interconnects are easily obtained by the solution of the model: this allows coupling the interconnect to the terminal devices and performing time-domain analysis, e.g. the typical signal-integrity tests.
Journal of Electromagnetic Analysis and Applications, 2012
Integral formulations are widely used for full-wave analysis of microstrip interconnects. A weak point of these formulations is the inclusion of the proper planar-layered Green's Functions (GFs), because of their computational cost. To overcome this problem, usually the GFs are decomposed into a quasi-dynamic term and a dynamic one. Under suitable approximations, the first may be given in closed form, whereas the second is approximated. Starting from a general criterion for this decomposition, in this paper we derive some simple criteria for using the closed-form quasi-dynamic GFs instead of the complete GFs, with reference to the problem of evaluating the full-wave current distribution along microstrips. These criteria are based on simple relations between frequency, line length, dielectric thickness and permittivity. The layered GFs have been embedded into a full-wave transmission line model and the results are first benchmarked with respect to a full-wave numerical 3D tool, then used to assess the proposed criteria.
IEEE Transactions on Electromagnetic Compatibility, 1996
The electromagnetic behavior of a planar structure formed by a conducting strip printed on a dielectric slab backed by a gridded ground plane is analyzed in order to outline the characteristics of this type of interconnect often used in microwave integrated circuits and digital applications. A two-port equivalent model, based on the 2-matrix network representation, is adopted to study the electrical properties of the structure. The 2-parameters have been determined by means of a fullwave spectral domain methodology. Numerical results concerning the properties of this type of interconnect for different grid geometries are presented, and the effects related to the radiation from the strip and the gddded ground plane are pointed out.
Computational electromagnetic methods for interconnects and small structures
Superlattices and Microstructures, 2000
The continual advances in speed and integration scale of electronic circuits have created enormous demands for high-speed, high-density packages which ensure reduced interconnection delays and improved electrical performance. Such structures usually involve a large number of planar transmission lines at various levels within the package, whereas the geometrical orientation of these lines is not necessarily uniform. Also, the existence of multiple dielectric layers, discontinuities, bends, and wire bounds adds considerable complexity to the package. It is therefore essential that full-wave computational electromagnetic (CEM) techniques, such as the finite element method (FEM) and the finite-difference time-domain (FDTD) method, be developed and used to accurately model the electrical performance of these devices and circuits.
Full-wave-based transmission-line model for lossy-substrate multiconductor interconnects
International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, 2007
A full-wave-based modal analysis is used for simulating a multiconductor coplanar waveguide (CPW) over a selectively etched lossy silicon substrate. Propagating modes, which are similar to the classic 'common' and 'differential' modes, are extracted, and circuit theory energy relationships are used for the determination of transmission-line model parameters. A time-frequency domain technique is employed for implementing the transmission-line model within a circuit simulator. The model is used to study the effect of etching the dielectric and the substrate for a two-conductor CPW line. The simulation results show that etching both the dielectric and the lossy substrate improves the loss and dispersion characteristics of the CPW line.
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In order to contribute to the improvement in the design of multilayer boards used for high-speed electronic applications, this project presents closed-form expressions for the capacitance and inductance related to vias (vertical transitions) in interconnects implemented in PCB technology. The importance of this contribution relies on the fact that these parasitic effects critically impact the performance of data channels by introducing undesired signal reflections. The development of the proposal is based on the systematic analysis of measurements and 3D electromagnetic simulations of actual high-speed links. Hence, a set of physically-based equivalent circuit models valid for different via pad sizes (scalable models) is obtained. This allows for the performance assessment and optimization of electrical transitions in channels in a fast and accurate way. Here, the proposal is applied to channels implemented in moderate-loss materials (loss tangent of about 0.035) and up to 10 GHz. N...
1999 IEEE International Symposium on Electromagnetic Compatability. Symposium Record (Cat. No.99CH36261), 1999
An efficient method is presented for rigorous analysis of incident field coupling to high speed interconnects. The method is based on generating time domain equivalent sources from incoming fields through finite difference time domain analysis (FDTD) and incorporating them with a circuit level simulator such as SPICE. With this approach, it is possible to perform a circuit analysis of arbitrarily shaped structures which are exposed to external fields. Moreover, the proposed method overcomes the numerical stability problems of FDTD when coupled with nonlinear terminations.
FULL-WAVE MODELING OF STRIPLINE STRUCTURES IN MULTILAYER DIELECTRICS
Progress in Electromagnetics Research-pier, 2006
A novel computational method based on full-wave analysis of stripline planar structures with vertical interconnects in multilayer dielectric media is presented. The method is based on the electric-field integral-equation solved with the Method of Moments (MoM). The special characteristics of stripline structures facilitate the extensive use of semi-analytical techniques to analyze the multilayer structures, limiting significantly the use of purely numerical techniques. The accuracy of the proposed modeling method is examined thoroughly with extensive numerical tests and the results are compared with results generated by commercial simulators for simple stripline structures.