Effects of aging and underfills on mechanical-drop tests of SnAgCu PBGA (plastic ball grid array) packages on ImAg PCB (printed circuit board) (original) (raw)

2007 International Conference on Electronic Materials and Packaging, 2007

Abstract

... John Lau1, Jeffery Lo2, Jimmy Lam2, Eng-Leong Soon3, Woai-Sheng Chow3, and Ricky Lee2 1Institute of Microelectronics, Singapore ... The dummy chip dimensions are 10x10mm, body dimensions are 12x12mm, and for other dimensions such as molding, substrate, and ...

John Lau hasn't uploaded this paper.

Let John know you want this paper to be uploaded.

Ask for this paper to be uploaded.